Dongguan Ziitek Electronical Material and Technology Co., Ltd
| Thermal conductive | 8.0W/mK |
| Payment Terms | T/T |
| Application | High Performance Computing |
| Thickness range(inch/mm) | 0.012"~0.120"(0.30~3.00mm) |
| Delivery Time | 3-5 work days |
| Keywords | high thermal conductivity thermal pad |
| Feature | Low dielectric constant effectively reduces signal loss |
| Supply Ability | 1000000 pcs/month |
| Products name | High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For High Performance Computing |
| Packaging Details | 24*13*12cm cartons |
| Hardness | 85 Shore 00 |
| Model Number | TIF100N 8085-06 |
| Certification | UL & RoHS |
| Brand Name | Ziitek |
| Place of Origin | China |
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Product Specification
| Thermal conductive | 8.0W/mK | Payment Terms | T/T |
| Application | High Performance Computing | Thickness range(inch/mm) | 0.012"~0.120"(0.30~3.00mm) |
| Delivery Time | 3-5 work days | Keywords | high thermal conductivity thermal pad |
| Feature | Low dielectric constant effectively reduces signal loss | Supply Ability | 1000000 pcs/month |
| Products name | High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For High Performance Computing | Packaging Details | 24*13*12cm cartons |
| Hardness | 85 Shore 00 | Model Number | TIF100N 8085-06 |
| Certification | UL & RoHS | Brand Name | Ziitek |
| Place of Origin | China | ||
| High Light | silicone thermal pad high thermal conductivity ，thermally conductive gap filler pads 8.0W/MK ，low dielectric thermal pads high performance computing | ||
The TIF®100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term durability requirements. Additionally, the material itself has low dielectric properties, which can effectively reduce energy loss during high-frequency signal transmission and ensure signal integrity.
| Property | Value | Test Method |
|---|---|---|
| Color | White | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 1.6 | ASTM D792 |
| Thickness Range (inch/mm) | 0.012~0.120 / 0.30~3.00 | ASTM D374 |
| Hardness (Shore 00) | 85 | ASTM 2240 |
| Recommended Operating Temperature (℃) | -40 to 200 | - |
| Breakdown Voltage (V/mm) | ≥3000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.0 | ASTM D150 |
| Volume Resistivity (Ohm*cm) | ＞1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 8.0W/m-K | ASTM D5470 / ISO22007 |
Standard Thickness: 0.012" (0.30mm)~0.120" (3.00 mm)
Standard Size: 4.7"×4.7" (120 mm×120 mm)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
Lead Time: For quantities of 5000 pieces, estimated time to be negotiated.
Are you a trading company or manufacturer?
We are a manufacturer with facilities in China and Vietnam.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Why Do AI Servers Need High-Performance Thermal Interface Materials?
AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.
How Do I Choose the Right Thermal Interface Material?
Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.
What Thermal Interface Materials Does ZIITEK Offer?
ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w... Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w...
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