Dongguan Ziitek Electronical Material and Technology Ltd.
| Products name | Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware |
| Keywords | Thermal Gap Filler Silicone Pads |
| Packaging Details | 24*13*12cm carton |
| Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Payment Terms | T/T |
| Application | For Effective Heat Transfer In Telecommunication Hardware |
| Construction | Ceramic filled silicone elastomer |
| Thermal conductive | 5.0 W/mK |
| Delivery Time | 3-8 work days |
| Hardness | 65/60 Shore 00 |
| Supply Ability | 100000pcs/month |
| Density | 3.3g/cm³ |
| Color | Dark grey |
| Sample | Free sample |
| Certification | UL and RoHs |
| Brand Name | Ziitek |
| Model Number | TIF100-50-11F |
| Place of Origin | China |
View Detail Information
Explore similar products
LED Heat Conduction Silicone Pad High Thermal Conductivity For Optimal Thermal
Garnet Telecommunication Hardware Naturally Tacky 6.0W Silicon Thermal Pad
China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad
Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe
Product Specification
| Products name | Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware | Keywords | Thermal Gap Filler Silicone Pads |
| Packaging Details | 24*13*12cm carton | Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Payment Terms | T/T | Application | For Effective Heat Transfer In Telecommunication Hardware |
| Construction | Ceramic filled silicone elastomer | Thermal conductive | 5.0 W/mK |
| Delivery Time | 3-8 work days | Hardness | 65/60 Shore 00 |
| Supply Ability | 100000pcs/month | Density | 3.3g/cm³ |
| Color | Dark grey | Sample | Free sample |
| Certification | UL and RoHs | Brand Name | Ziitek |
| Model Number | TIF100-50-11F | Place of Origin | China |
Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Products description
The TIF®100-50-11F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.
| Typical Properties of TIF®100-50-11F Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 60 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.5 | ASTM D150 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity(W/m-K) | 5.0 | ASTM D5470 | |
| 5.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
Get in touch with us
Leave a Message, we will call you back quickly!