Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Product ame | Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad |
| Thickness | 1.0mmT |
| Specific Gravity | 3.0g/cc |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 2.6W/m-K |
| Color | Blue |
| Keywords | Thermal Conductive Pad |
| Application | CPU/LED/PCB/GPU/SSD |
| Brand Name | Ziitek |
| Model Number | TIF540BS |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Product ame | Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad | Thickness | 1.0mmT |
| Specific Gravity | 3.0g/cc | Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 2.6W/m-K | Color | Blue |
| Keywords | Thermal Conductive Pad | Application | CPU/LED/PCB/GPU/SSD |
| Brand Name | Ziitek | Model Number | TIF540BS |
| Certification | UL & RoHS | Place of Origin | China |
| High Light | PCB Thermal Insulation Silicone Pad ，LED Thermal Insulation Silicone Pad ，CPU Thermal Insulation Silicone Pad | ||
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
The TIF®540BS Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 2.6W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
| Typical Properties of TIF®500BS Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 30 Shore 00 | 13 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 5.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1013 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 2.6 W/m-K | ASTM D5470 | |
| 2.6 W/m-K | ISO22007 | ||
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
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