Shenzhen TingFeng Hardware Products Co.,Ltd
| Payment Terms | T/T |
| Supply Ability | 10000000pieces/per month |
| Delivery Time | 3days/Start |
| Packaging Details | Carton packaging 18*15*12cm (packaging can be customized according to customer product requirements) |
| Product Type | Progressive Die Stamping Parts |
| Main Material | Stainless Steel / Aluminum Alloy |
| Material Thickness | 0.3-1.2mm |
| Process Feature | Precision Etching & Stamping / Invisible Carrier |
| Tolerance Grade | High-Precision (±0.02mm) |
| Application Industry | Precision Shielding Cans / FPC Steel Sheets |
| Surface Finish | Nickel Plating / Tin Plating |
| Mold Life | 100K-500K cycles |
| Brand Name | TF |
| Model Number | TF-002 |
| Certification | lSO9001 |
| Place of Origin | Shenzhen, China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000000pieces/per month |
| Delivery Time | 3days/Start | Packaging Details | Carton packaging 18*15*12cm (packaging can be customized according to customer product requirements) |
| Product Type | Progressive Die Stamping Parts | Main Material | Stainless Steel / Aluminum Alloy |
| Material Thickness | 0.3-1.2mm | Process Feature | Precision Etching & Stamping / Invisible Carrier |
| Tolerance Grade | High-Precision (±0.02mm) | Application Industry | Precision Shielding Cans / FPC Steel Sheets |
| Surface Finish | Nickel Plating / Tin Plating | Mold Life | 100K-500K cycles |
| Brand Name | TF | Model Number | TF-002 |
| Certification | lSO9001 | Place of Origin | Shenzhen, China |
| High Light | High Precision progressive metal stamping ，Stable progressive metal stamping ，High Precision progressive die components | ||
Precision EMI Shielding Covers & FPC Reinforcements via Hybrid Manufacturing
1．Progressive Die Stamping Quick Detail
We combine precision etching and progressive die stamping technologies to provide ultra-precision metal parts for high-end electronic products. For ultra-narrow bridging, sharp-cornered concave areas, or micro-grids that are difficult to achieve with traditional stamping, we employ a composite process that first etches the approximate outline and fragile connection points, and then uses a progressive die for precise shaping and separation. This method achieves near-etching precision and flexibility while possessing the efficiency and cost advantages of stamping, making it particularly suitable for products such as high-precision shielding covers and FPC reinforcing steel sheets.
2. Progressive Die Stamping Product Description
In modern electronic devices striving for extreme miniaturization, electromagnetic shielding covers and flexible printed circuit board (FPC) reinforcements require complex three-dimensional shapes and extremely high dimensional accuracy within a very small space. Our hybrid "etching + progressive die" process is designed to address these challenges. We can produce precision shielding covers with extremely thin walls, excellent side perpendicularity, and multiple inward bends; we can also produce FPC steel sheets with precise positioning holes and complex shapes, ensuring their stability and solderability during SMT assembly.
3． Progressive Die Stamping Product Features & Advantage
|
Feature |
Advantage to You |
|
Break Geometric Limitations of Traditional Stamping |
Combined with etching, easily achieve features like sharp corners, ultra-narrow cantilevers (<0.2mm), fine meshes, broadening the design boundaries of stampings. |
|
High-Precision 3D Complex Forming |
By performing continuous die bending and stretching on the etched precision contours, miniature box-shaped and shell-like parts with excellent dimensional accuracy and consistency can be obtained. |
|
“Invisible” Carrier Design Reduces Scrap |
Use extremely fine or dot-shaped connecting tabs as carriers after etching, leaving almost no marks after final blanking and separation, improving part appearance and functionality. |
|
Suitable for Easily-Deformed Thin Materials |
This process has little impact on the stress of the material and is particularly suitable for processing thin and easily warped stainless steel or alloy materials, resulting in good flatness after forming. |
|
Cost-Effective Precision Solution |
Compared to pure etching, it greatly reduces material loss and processing time; compared to pure stamping, it achieves higher precision and complexity, thus achieving the best balance. |
4．Progressive Die Stamping Product Specification
|
Specification Item |
Detail / Range |
Note |
|
Etching + Stamping Material Thickness |
0.1 mm — 0.5 mm (Optimal) |
Ultra-thin materials have obvious advantages |
|
Minimum Bridge Width/Gap (Etched Part) |
0.15 mm |
Material and thickness dependent |
|
Post-Forming Dimensional Accuracy |
±0.02 mm — ±0.05 mm |
Comprehensive process capability |
|
Bending Angle Accuracy (Micro) |
±1.0° |
Achieve in a tiny size |
|
Carrier Connection Point Residue |
Minimal, removable by hand or slight vibration |
Meets appearance requirements |
|
Surface Treatment Compatibility |
Good, suitable for electroplating and other treatments. |
Need to consider differences between etched and stamped surfaces |
|
Typical Application Part Size |
Several millimeters to tens of millimeters |
Suitable for small precision parts |
5. Progressive Die Stamping Product Application
Our composite process components are the guardians and supporters of high-end microelectronic components: RF and Microwave Module Shielding | 5G millimeter-wave antenna module shielding covers, RF power amplifier shielding boxes, requiring extremely high dimensional accuracy to ensure electromagnetic insulation performance.
Chip-Level Packaging and Testing | Miniature heat sinks for CSPs and WLCSPs, contact springs for test sockets, miniature in size and precise in structure.
Flexible Printed Circuit (FPC) Components | FPC adhesive-backed steel sheet reinforcement plates, ZIF connector bases, FPC brackets for camera modules, requiring precise positioning and flatness.
Miniature Sensor Packaging | MEMS sensor metal cover plates, biosensor electrode pads, often mating with plastic or ceramic components, requiring strict tolerances.
6. Frequently Asked Questions (FAQ)
Q: Can you handle complex custom designs and provide design optimization suggestions
A: Absolutely. This is our core expertise. We provide free DFM analysis within 3-5 days, often helping clients achieve 15-30% cost reduction through design for manufacturability.
Q: How do you ensure quality consistency and handle defect issues?
A: We implement a rigorous 4-stage QC system with 100% full inspection. Our track record shows 99.99% qualification rate.
Q: What are your lead times and how do you handle urgent orders?
A: Standard lead times: 3-7 days for prototypes, 7-15 days for mass production. We offer VIP prioritization cutting lead times by up to 30%.
Q: Will I get timely responses and professional support throughout the project?
A: Yes. You get a 1v1 exclusive consultant with 1-hour initial response commitment and 24-hour technical support.
Q: Can you provide material certifications and environmental compliance reports?
A: Yes. We provide material certifications and environmental test reports (RoHS, REACH compliant) upon request.
Q: How do you protect my designs and intellectual property?
A: We start with mutual NDA and implement strict mold ownership protection and confidential data security measures.
Q: What are your payment terms and MOQ requirements?
A: We offer flexible payment terms (T/T, L/C at sight) and MOQ from 1 piece for prototyping.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
the year20
Total Annual:
20000000-30000000
Employee Number:
60~70
Ecer Certification：
Verified Supplier
Company Profile Tingfeng Hardware — Your Partner for High-Precision Non-Standard Components Since 2010, with 15 years of dedication, we focus on one mission: solving your “un-makeable, small-batch, urgent, and difficult” non-standard part manufacturing challenges. Core Streng... Company Profile Tingfeng Hardware — Your Partner for High-Precision Non-Standard Components Since 2010, with 15 years of dedication, we focus on one mission: solving your “un-makeable, small-batch, urgent, and difficult” non-standard part manufacturing challenges. Core Streng...
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