Ring PCB Technology Co.,Limited
Products
Manufacturer of a wide range of products which include Aluminum PCB for LED Lighting PCBA Supplier Printed Circuit Board Manufacturing,Integrated Polyimide Flex Rigid PCB Board PCBA Turnkey Service Full Assembly,Muti Layers SMD HD...
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing |
| PCB type | rigid pcb |
| Layer Count | Up to 40 layers with high-density designs or customizable |
| Board Thickness | 0.2 mm to 10 mm or customizable |
| Min.Trace/Space | 3/3 mil |
| hole size | 0.15 mm, supporting complex via designs |
| Board Size | Up to 600 mm x 1200 mm or customizable |
| Materials Supported | FR-4,Rogers,Taconic,aluminum,copper ceramic |
| Surface Finishes | ENIG,HASL, OSP, immersion silver,immersion tin,and hard gold |
| Quality Testing | AOI, X-Ray inspection, electrical testing |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Special Capabilities | Rigid-Flex, metal-core,high-frequency,and high-temperature PCBs |
| Copper Thickness | 1/3oz-6oz |
| Application Areas | Consumer Electronics,Automotive parts,Power suppliesMedical Devices,LED Lighting,ect |
| Brand Name | Ring or support OEM |
| Model Number | rigid pcb |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing |
| PCB type | Rigid power inverters PCB |
| Layer Count | Up to 48 layers with high-density designs or customizable |
| Board Thickness | 0.2 mm to 10 mm or customizable |
| Min.Trace/Space | 3/3 mil |
| hole size | 0.15 mm, supporting complex via designs |
| Board Size | Up to 600 mm x 1200 mm or customizable |
| Materials Supported | FR-4,Rogers,Taconic,aluminum,copper ceramic |
| Surface Finishes | ENIG,HASL, OSP, immersion silver,immersion tin,and hard gold |
| Quality Testing | AOI, X-Ray inspection, electrical testing |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Special Capabilities | Rigid-Flex, metal-core,high-frequency,and high-temperature PCBs |
| Application Areas | Consumer Electronics,Automotive parts,Power suppliesMedical Devices,LED Lighting,ect |
| Brand Name | Ring or support OEM |
| Model Number | rigid pcbs--Rigid power inverters PCB |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing+Cardboard packing case |
| PCB type | HDI PCB |
| Minimum Hole Size (Micro-via) | 0.1 mm (100 microns) |
| Minimum Trace Width / Space | 0.075 mm (3mil) |
| Layer Count | Up to 40 layers |
| Types of Vias | Micro-vias, Blind, Buried, Stacked |
| Material Types | FR4, High-Tg FR4, Polyimide, Rogers, PTFE |
| High Frequency Mixed HDI | Ceramic，PTFE just can do machine drilling for blind or buried via, or back drilling,(can't do laser drilling) |
| Surface Finishes | ENIG, HASL, Immersion Silver, Immersion Tin |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Copper Thickness (Inner/Outer Layers) | 0.5 oz to 3 oz |
| Application Areas | Telecommunications,Automotive, wearable health monitors,Consumer Electronics |
| Thermal Management | Thermal vias, custom heat sink options |
| Inspection Techniques | AOI, X-Ray, Electrical Testing |
| Brand Name | Ring or support OEM |
| Model Number | HDI PCB (High-Density Interconnect PCB) |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing+Cardboard packing case |
| PCB type | HDI PCB |
| Minimum Hole Size (Micro-via) | 0.1 mm (100 microns) |
| Minimum Trace Width / Space | 0.075 mm (3mil) |
| Layer Count | Up to 40 layers |
| Types of Vias | Micro-vias, Blind, Buried, Stacked |
| Material Types | FR4, High-Tg FR4, Polyimide, Rogers, PTFE |
| High Frequency Mixed HDI | Ceramic，PTFE just can do machine drilling for blind or buried via, or back drilling,(can't do laser drilling) |
| Surface Finishes | ENIG, HASL, Immersion Silver, Immersion Tin |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Copper Thickness (Inner/Outer Layers) | 0.5 oz to 3 oz |
| Application Areas | Telecommunications,Automotive, wearable health monitors,Consumer Electronics |
| Thermal Management | Thermal vias, custom heat sink options |
| Inspection Techniques | AOI, X-Ray, Electrical Testing |
| Brand Name | Ring or support OEM |
| Model Number | HDI PCB (High-Density Interconnect PCB) |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing+Cardboard packing case |
| PCB type | HDI PCB |
| Minimum Hole Size (Micro-via) | 0.1 mm (100 microns) |
| Minimum Trace Width / Space | 0.075 mm (3mil) |
| Layer Count | Up to 40 layers |
| Types of Vias | Micro-vias, Blind, Buried, Stacked |
| Material Types | FR4, High-Tg FR4, Polyimide, Rogers, PTFE |
| High Frequency Mixed HDI | Ceramic，PTFE just can do machine drilling for blind or buried via, or back drilling,(can't do laser drilling) |
| Surface Finishes | ENIG, HASL, Immersion Silver, Immersion Tin |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Copper Thickness (Inner/Outer Layers) | 0.5 oz to 3 oz |
| Application Areas | Telecommunications,Automotive, wearable health monitors,Consumer Electronics |
| Thermal Management | Thermal vias, custom heat sink options |
| Inspection Techniques | AOI, X-Ray, Electrical Testing |
| Brand Name | Ring or support OEM |
| Model Number | HDI PCB (High-Density Interconnect PCB) |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
MOQ: 1unit
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 50000㎡per week |
| Delivery Time | 7-14 working days |
| Packaging Details | Vacuum packing+Cardboard packing case |
| PCB type | HDI PCB |
| Minimum Hole Size (Micro-via) | 0.1 mm (100 microns) |
| Minimum Trace Width / Space | 0.075 mm (3mil) |
| Layer Count | Up to 40 layers |
| Types of Vias | Micro-vias, Blind, Buried, Stacked |
| Material Types | FR4, High-Tg FR4, Polyimide, Rogers, PTFE |
| High Frequency Mixed HDI | Ceramic，PTFE just can do machine drilling for blind or buried via, or back drilling,(can't do laser drilling) |
| Surface Finishes | ENIG, HASL, Immersion Silver, Immersion Tin |
| Certifications | IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949 |
| Copper Thickness (Inner/Outer Layers) | 0.5 oz to 3 oz |
| Application Areas | Telecommunications,Automotive, wearable health monitors,Consumer Electronics |
| Thermal Management | Thermal vias, custom heat sink options |
| Inspection Techniques | AOI, X-Ray, Electrical Testing |
| Brand Name | Ring or support OEM |
| Model Number | HDI PCB (High-Density Interconnect PCB) |
| Certification | ISO9001, ISO14001, ISO13485, and IATF16949. |
| Place of Origin | Shenzhen, China |
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