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Guangdong Uchi Electronics Co.,Ltd

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China Gold-Plated Miniature Liquid Cooling Low-Thermal-Resistance Applications.
China Gold-Plated Miniature Liquid Cooling Low-Thermal-Resistance Applications.

  1. China Gold-Plated Miniature Liquid Cooling Low-Thermal-Resistance Applications.

Gold-Plated Miniature Liquid Cooling Low-Thermal-Resistance Applications.

  1. MOQ: 100pcs
  2. Price: 1300-1500 dollars
  3. Get Latest Price
Payment Terms T/T,paypal, Western Union,MoneyGram
Supply Ability 50000000pcs per Month
Delivery Time not limited
Fluid Water or suitable coolant
Noise 17dbA
Surface Anodized, Polished
Surfacefinish Nickel-plated or anodized
Width According to customer demand
Deep Process CNC machining
Product Weight 0.78 kg
Weight Approximately 200 grams
Single Gross Weight 1.000 kg
Working Pressure At least 1 bar
Power Interface 3Pin
Installation Size 10 * 20
Brand Name Uchi
Model Number Heat Sink
Certification SMC
Place of Origin Dongguan,Guangdong,China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T,paypal, Western Union,MoneyGram Supply Ability 50000000pcs per Month
Delivery Time not limited Fluid Water or suitable coolant
Noise 17dbA Surface Anodized, Polished
Surfacefinish Nickel-plated or anodized Width According to customer demand
Deep Process CNC machining Product Weight 0.78 kg
Weight Approximately 200 grams Single Gross Weight 1.000 kg
Working Pressure At least 1 bar Power Interface 3Pin
Installation Size 10 * 20 Brand Name Uchi
Model Number Heat Sink Certification SMC
Place of Origin Dongguan,Guangdong,China
High Light gold-plated liquid cooling plateminiature low-thermal-resistance coolingliquid cooling plate with warranty

Gold-Plated Miniature Liquid Cooling Plate

 
Gold-plated miniature liquid cooling plates are micro liquid cooling heat dissipation components designed for high-precision, high-reliability, and low-thermal-resistance applications. They typically feature centimeter-scale dimensions and millimeter-level thickness. Their core structure consists of a copper, aluminum, or molybdenum-copper base with a gold-plated surface, achieving ultra-low interface thermal resistance, corrosion resistance, oxidation resistance, as well as solderability and bondability.
 

I. Core Features (Matching your requirements: strong heat dissipation, no leakage, long service life)

 

1. Strong Heat Dissipation (Ultra-low Resistance, Micro-channels)

 
  • Base material: mostly oxygen-free high-conductivity copper (OFHC Cu) or molybdenum-copper (MoCu), with thermal conductivity of 380~401 W/m·K.
  • Flow channels: micro-channels, pin fins, or etched channels (50~200μm in width), with thermal resistance as low as 0.01~0.05℃·cm²/W.
  • Gold-plated interface: gold (~317 W/m·K) is non-oxidizing with extremely low contact thermal resistance, superior to nickel or tin coatings.
  • Ultra-thin profile: thickness 1~5mm, providing an extremely short heat transfer path from heat source to coolant.
 

2. No Leakage (Miniature High-Reliability Sealing)

 
  • Processes: vacuum brazing, diffusion bonding, laser welding (adhesives and sealing rings free).
  • Pressure resistance: 3~10 bar, helium leak rate ≤1×10⁻⁸ Pa·m³/s.
  • Small size: 20×20mm ~ 80×80mm, suitable for chips, lasers, and RF devices.
 

3. Long Service Life (Corrosion Resistance, Anti-aging, High Durability)

 
  • Gold plating thickness: 0.1~2μm (commonly 0.5~1μm).
  • Chemical inertness: water resistant, salt spray resistant, non-oxidizing, free from galvanic corrosion.
  • Diffusion barrier: typically a 3~5μm nickel underlayer to prevent copper migration.
  • Temperature range: -55℃~150℃, stable under thermal cycling.
  • Service life: meets military / aerospace / optical module standards (10~20 years).
 

II. Real Functions of Gold Plating (Not for Decoration)

 
  • Reduce interface thermal resistance: direct contact with chips / heat sinks, no oxide layer, stable thermal resistance.
  • Anti-corrosion: no rust, scaling, or electrical leakage in coolant or air environments.
  • Solderable & bondable: compatible with soldering, AuSn soldering, and ultrasonic bonding (semiconductor / optical communications).
  • Anti-galvanic corrosion: stable potential between copper and gold in liquid cooling systems, avoiding electrochemical corrosion.
  • High reliability: zero-failure requirements for military, aerospace, and medical applications.
 

III. Main Structures and Processes

 

Micro-channel Etched Type (Most Common)

 
Copper etching → cover plate brazing → overall gold plating.
 
Applications: lasers, optical modules, AI chips, FPGAs, high-power ICs.
 

Tube-embedded Miniature Type

 
Thin copper tubes (φ1~3mm) press-fitted / brazed → surface gold plating.
 
Applications: medical instruments, high-precision sensors, small lasers.
 

Gold-Plated MoCu / WCu Type

 
Low thermal expansion, high thermal conductivity, with nickel + gold plating barrier layer.
 
Applications: military, aerospace, high-power microwaves, VCSEL / pump sources.
 

IV. Typical Application Scenarios

 
  • Optical communications: TOSA/ROSA, EDFA, high-speed optical modules, laser diodes.
  • Semiconductors: high-end CPU/GPU/ASIC, SiC/GaN power chips, probe stations.
  • Military / Aerospace: missile-borne computers, radar T/R components, satellite electronics.
  • Medical treatment: precision instruments, laser therapy, superconducting / cryogenic probes.
  • High-end industrial control: high-precision servos, LiDAR, quantum computing chips.
 

V. Key Parameters (Industry Standard)

 
  • Dimensions: 20×20 ~ 80×80mm, thickness 1~5mm.
  • Materials: OFHC copper (C1100/C1020), molybdenum-copper (MoCu).
  • Plating: Ni 3~5μm + Au 0.5~1μm (hard gold / soft gold).
  • Flow resistance: 0.5~2 bar @ 0.5~2 L/min.
  • Thermal resistance: 0.02~0.08℃·cm²/W (@25℃ water).
  • Working pressure: ≥6 bar, bursting pressure ≥12 bar.
  • Leak detection: helium leak rate ≤1×10⁻⁸ Pa·m³/s.
 

VI. One-Sentence Summary

 
Gold-plated miniature liquid cooling plate = miniaturization + micro-channels + high-thermal-conductivity base + gold-plated surface. Through ultra-precision manufacturing, it achieves ultra-low interface thermal resistance, zero leakage, long service life, and corrosion resistance, making it a “gold-standard” cooling solution for high-end precision electronics, lasers, and optical modules.
 
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2006

  • Total Annual:

    1,500,000-2,500,000

  • Employee Number:

    138~168

  • Ecer Certification:

    Verified Supplier

Uchi was established in 2006 in Dongguan, China.  After years of development, Uchi has become a large scale hi-tech enterprise that specialized in development and production of complete series of MOV,PTC, NTC series, PPTC series, Fuse(ALL TYPE),Resistor、integrated circuit 、 Capacitor, ... Uchi was established in 2006 in Dongguan, China.  After years of development, Uchi has become a large scale hi-tech enterprise that specialized in development and production of complete series of MOV,PTC, NTC series, PPTC series, Fuse(ALL TYPE),Resistor、integrated circuit 、 Capacitor, ...

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Get in touch with us

  • Reach Us
  • Guangdong Uchi Electronics Co.,Ltd
  • Room 810, Unit 2, Building 5, Huixing Commercial Center, Dongsheng Road No.1, Zhongshan Dong, Shilong Town Dongguan, GUANGDONG, 523326 CN
  • https://www.uchidg.com/

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