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A brazed liquid cooling plate is a liquid-cooled heat dissipation plate formed by welding the upper and lower cover plates and the internal flow channels / fins in a high-temperature vacuum furnace using the brazing process. It features excellent sealing performance, precise flow channels, low thermal resistance and high pressure resistance, making it one of the mainstream processes for high-end liquid cooling plates.
I. Basic Structure
It generally consists of three layers:
Upper cover plate: provides sealing, interfaces and mounting surface
Middle layer: flow channel plate / turbulence fins / pin fins
Lower cover plate: bonding surface for heat-generating components
The three layers are metallurgically bonded into an integral unit through brazing.
II. Core Process: Vacuum Brazing
Sheet metal forming → coating / pre-placing brazing filler metal
Stacking and positioning → loading into vacuum brazing furnace
High-temperature heating (approx. 600℃ for aluminum)
Brazing filler metal melts, wets and fills gaps
Cooling and forming to create high-strength sealed welds
Advantages:
No porosity, no cold joints, extremely high airtightness
High weld strength and good corrosion resistance
Enables complex and precise flow channel designs
Smooth surface, ideal for bonding high-power devices
III. Key Features
High heat dissipation efficiency
Micro-channels, louvered fins and porous fins can be integrated in the middle layer, delivering large heat exchange area and low thermal resistance.
Strong pressure resistance
Standard pressure rating: 3～10 bar; high-pressure versions exceed 15 bar, suitable for fast charging, energy storage and electric motors.
Reliable sealing
Fully welded structure with nearly zero leakage risk, compliant with helium leak testing.
Excellent surface flatness
Suitable for surface-mounted heat dissipation of IGBTs, SiC modules, power devices, battery packs and other planar components.
Mainly made of aluminum alloy
Commonly uses 3003, 5052, 6061 and other alloys, offering lightweight design, high thermal conductivity and moderate cost.
IV. Common Flow Channel Designs
Serpentine flow channel: simple structure, low pressure drop
Staggered / parallel multi-channels: uniform heat transfer
Micro-channel fins: for high heat flux density scenarios
Pin fin array: ultra-high heat transfer, suitable for GPUs / lasers
V. Typical Applications
New energy vehicles: motor controllers, OBC, DC-DC converters, 800V SiC modules
Energy storage & fast charging: PCS energy storage converters, ultra-fast charging stations, heat dissipation for flash charging shunts
Industrial control & power: SVG, photovoltaic inverters, high-voltage inverters
Optoelectronics & computing power: lasers, GPU servers, radar systems
VI. Comparison with Other Liquid Cooling Plates
vs Friction stir welded liquid cooling plates:
Brazing is more suitable for precise flow channels and high heat flux density; friction welding performs better for large-size and high-flow applications.
vs Extruded profile liquid cooling plates:
Brazed plates offer more flexible flow channel design and stronger heat dissipation, at a higher cost.
vs Tube-embedded liquid cooling plates:
Better bonding performance and lower thermal resistance, ideal for high-power devices.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Exporter
Year Established:
2006
Total Annual:
1,500,000-2,500,000
Employee Number:
138~168
Ecer Certification：
Verified Supplier
Uchi was established in 2006 in Dongguan, China.
After years of development, Uchi has become a large scale hi-tech enterprise that specialized in development and production of complete series of MOV,PTC, NTC series, PPTC series, Fuse(ALL TYPE),Resistor、integrated circuit 、 Capacitor, ... Uchi was established in 2006 in Dongguan, China.
After years of development, Uchi has become a large scale hi-tech enterprise that specialized in development and production of complete series of MOV,PTC, NTC series, PPTC series, Fuse(ALL TYPE),Resistor、integrated circuit 、 Capacitor, ...
