Unicomp Technology
| Payment Terms | T/T,L/C |
| Supply Ability | 30 sets per month |
| Delivery Time | 30 days |
| Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | BGA X-Ray Inspection Machine |
| X-ray Coverage | 48mm x 54mm |
| Industry | Electronics Industry |
| Resolution | 208Lp/cm |
| X-ray Leakage | < 1uSv/h |
| Power Consumption | 0.5kW |
| Brand Name | UNICOMP |
| Model Number | CX3000 |
| Certification | CE, FDA |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,L/C | Supply Ability | 30 sets per month |
| Delivery Time | 30 days | Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | BGA X-Ray Inspection Machine | X-ray Coverage | 48mm x 54mm |
| Industry | Electronics Industry | Resolution | 208Lp/cm |
| X-ray Leakage | < 1uSv/h | Power Consumption | 0.5kW |
| Brand Name | UNICOMP | Model Number | CX3000 |
| Certification | CE, FDA | Place of Origin | China |
| High Light | bga x ray inspection system ，bga inspection equipment | ||
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine
| Item | Definition | Specs |
| System Parameters | Size | 750(L)x570(W)x890(H)mm |
| Weight | 300kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.5kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 100kV | |
| Max.Power | 200μA | |
| Spot Size | 5μm | |
| Detector | Intensifier | FPD |
| X-ray Coverage | 48mm x 54mm | |
| Resolution | 208Lp/cm | |
| Work Station | Max.Loading Size | 200mm x 200mm |
| Max.Inspection Area | 200mm x 200mm | |
| Oblique Angle Views | 360° rotary fixture (Optional) | |
| X-ray Leakage | <1μSv/h | |
X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.
Application:
1.BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images:
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
600~700
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip...
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