Unicomp Technology
| Payment Terms | T/T, L/C |
| Supply Ability | 300 sets per month |
| Delivery Time | 30 days |
| Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | Unicomp X-ray Inspection Machine |
| Application | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
| Industry | Electronics Industry |
| X-ray Leakage | < 1uSv/h |
| Brand Name | UNICOMP |
| Model Number | LX9200 |
| Certification | CE, FDA |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, L/C | Supply Ability | 300 sets per month |
| Delivery Time | 30 days | Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | Unicomp X-ray Inspection Machine | Application | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
| Industry | Electronics Industry | X-ray Leakage | < 1uSv/h |
| Brand Name | UNICOMP | Model Number | LX9200 |
| Certification | CE, FDA | Place of Origin | China |
| High Light | 3D CT Unicomp X Ray ，Inline Computed Temography Machine ，130KV Unicomp X Ray | ||
Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection
Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200
As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users.
Application Field
| SMT/PCBA | Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... |
| Semiconductor | Package type: W/B, IC, F/C... Defect type: Void, Open, Short, Sweep, Solder ball... |
| Other areas | Battery, IGBT... |
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1640(W)*2070(D)*1800(H)mm |
| Machine Weight | ≈3450kg |
| Power Supply | 220AC/50Hz |
| Power | 5.5 kW |
| X-ray Leakage | < 0.5µSv/h |
| Imaging System | |
| Tube Type | Closed |
| Max. Voltage | 130kV |
| Detector | FPD |
| Image Acquisition | 2D/2.5D/3D |
| Inspection Area | |
| Max. Inspection Area (M Size) | 255*330mm |
| Max. Inspection Area (L Size) | 440*550mm |
| Max.Inspection Area (XL Size) | 610*1200mm |
| PCBA thickness | 0.5~5mm |
| PCBA Craft side | 5mm |
| PCBA warpage compensation | ±2mm |
| Clearance Top | 70mm |
| Clearance Bottom | 40mm |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection images
Function Features
2D, 2.5D, and 3D all in one Inline X-Ray Inspection System
Multiple Resolution Selected (Max. 6μm)
130KV Closed Micro-focus X-Ray Generator
Real-time image with HD FPD Detector
11-axis Linkage System
360° Circular CT Image
Data Tracking and Reworking System Embedded
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
600~700
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip...
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