Unicomp Technology
| Payment Terms | T/T,L/C |
| Supply Ability | 30 sets per month |
| Delivery Time | 30 days |
| Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Navigation And Positioning | Quickly locate physical images |
| Door Open | Hand-operated door |
| Detection Area | 129*129[mm] |
| Frame Rates | Max30fps |
| Pixel Size | 84μm |
| Geometric Magnification | 48.8X (Under Specific Circumstances) |
| Brand Name | UNICOMP |
| Model Number | AX8300 |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,L/C | Supply Ability | 30 sets per month |
| Delivery Time | 30 days | Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Navigation And Positioning | Quickly locate physical images | Door Open | Hand-operated door |
| Detection Area | 129*129[mm] | Frame Rates | Max30fps |
| Pixel Size | 84μm | Geometric Magnification | 48.8X (Under Specific Circumstances) |
| Brand Name | UNICOMP | Model Number | AX8300 |
| Certification | CE | Place of Origin | China |
| High Light | x ray scanning machine ，security x ray machine | ||
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection.
As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts.
| System Summary | Dimension | 1215(W)∗1325(D)∗1700(H)mm |
| Machine Weight | 1350kg | |
| Power Supply | 220V±10% 50Hz/60Hz 4A | |
| Power Consumption | 900W | |
| X-Ray Tube | Tube Type | Sealed |
| Voltage | 110kV | |
| Max.Power | 25W | |
| Min.Resolution | 5µm | |
| Other Features | X-Ray Safety | <1µSv/h |
Major applications:
PCBA BGA/IC LED Aliminum die casting Battery connector inspecting
1. Semiconductor package
2. Electronic connector module.
3. Original Package
4. Aerospace components
5. Medical appliances
6. Automation components
Application:
1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2. QFN:Bridging,Voids,Opens,Registration
3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images
Application Fields
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
600~700
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip...
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