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Unicomp Technology

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT
China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT

  1. China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT
  2. China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT
  3. China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT
  4. China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT
  5. China 160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT

160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT

  1. MOQ: 1 set
  2. Price: Can negotiate
  3. Get Latest Price
Payment Terms T/T,L/C
Supply Ability 30 sets per month
Delivery Time 30-35 days after order confirmation
Packaging Details Wooden Case, Waterproof, Anti-collision
Machine Type Semiconductor Microfocus X-ray Inspection Equipment
Dimensions 1690mm(L)×2116mm(W)×1880mm(H)
Tube Type Open Type
Machine Weight 4590KG
Voltage 160kv
Model AX9600
Brand Name Unicomp
Model Number AX9600
Certification CE, FDA
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T,L/C Supply Ability 30 sets per month
Delivery Time 30-35 days after order confirmation Packaging Details Wooden Case, Waterproof, Anti-collision
Machine Type Semiconductor Microfocus X-ray Inspection Equipment Dimensions 1690mm(L)×2116mm(W)×1880mm(H)
Tube Type Open Type Machine Weight 4590KG
Voltage 160kv Model AX9600
Brand Name Unicomp Model Number AX9600
Certification CE, FDA Place of Origin China
High Light 160KV microfocus X-ray machinesemiconductor wire bonding inspectionNDT X-ray machine AX9600
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution tailored for advanced IC packaging, HBM storage dies, and GPU semiconductor device quality verification.
Technical Specifications
System Summary
Dimensions 1690mm(L)×2116mm(W)×1880mm(H)
Weight 4590kg
Power Supply 220V±10% 50Hz/60Hz 9A
Power Consumption 2kw
X-ray Tube
Tube Type Open Type
Voltage 160kv
Max. Power 64W
Min.Resolution 1µm
Imaging System
X-ray Detector FPD
Pixel Size 84µm
Detection Area 129*129mm
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
System Magnification 34000X
Motion Control System
Max. Payload Size 520*520[mm]
Max. Detection Size 520*520[mm]
X/Y/Z-Axis Travel Distance 550/710/265[mm]
Tilt and Rotation Detect XY±70° Tilt
Industrial PC
Motion Control Mode 34"HD 4K curved display
Operating System Windows 11 64-bit
Storage 4TB HDD+512G SSD
Memory 32G
Processor i5 12 generation
Other Features
Door Operation Automatic Door
X-Ray Safety <1µSv/h
Applications
The UNICOMP AX9600 high-power microfocus X-ray inspection system is engineered for ultra-precision non-destructive evaluation (NDE) of advanced semiconductors and microelectronic components. It delivers high-fidelity void fraction quantification for TVS diodes, alongside internal flaw inspection for advanced IC packages, HBM high-bandwidth memory dies, GPU modules and high-density electronic assemblies.
Extensively deployed for quality validation across automotive electronics, power semiconductors, aerospace-grade electronic hardware and miniature precision components, the system facilitates precise characterization of micro-voids, solder joint anomalies, internal fractures and assembly irregularities. It provides robust technical backing for R&D validation and mass production process quality control within the high-end semiconductor manufacturing sector.
Inspection Images
UNICOMP AX9600 X-ray inspection system sample inspection image showing high-precision component analysis
Sample Inspection Image
UNICOMP AX9600 X-ray inspection system dimensions and physical appearance diagram
System Dimensions and Appearance

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter,Seller

  • Year Established:

    2002

  • Total Annual:

    60 Million-100 Million

  • Employee Number:

    600~700

  • Ecer Certification:

    Verified Supplier

X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip...

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Get in touch with us

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  • Unicomp Technology
  • Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
  • https://www.unicompxray.com/

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