| Cycle Time | 4000ms (Dependent on product) |
| Die Size | 0.15×0.15mm-15×15mm |
| Die Thickness | Thickness: ≥70um |
| NTC | Tape & Reel, Electronic Feeder |
| Capacity | 2000-4000 pcs/h (Depending on jig matrix density) |
| Packaging Details | carton box/wooden box |
| Payment Terms | T/T |
| Brand Name | UW |
| Certification | CE ISO |
View Detail Information
Explore similar products
Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors
Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips
Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System
Picosecond Laser Wafer Scribing Machine To 8 Inches Size High Precision
Product Specification
| Cycle Time | 4000ms (Dependent on product) | Die Size | 0.15×0.15mm-15×15mm |
| Die Thickness | Thickness: ≥70um | NTC | Tape & Reel, Electronic Feeder |
| Capacity | 2000-4000 pcs/h (Depending on jig matrix density) | Packaging Details | carton box/wooden box |
| Payment Terms | T/T | Brand Name | UW |
| Certification | CE ISO | ||
| High Light | Automatic Die Bonder Machine For FRD ,IGBT Chips Automatic Die Bonder Machine ,Die Bonder Machine For Resistors | ||
Equipment Overview
The equipment is designed for the pick-and-place (P&P) of FRD, IGBT chips, resistors, and soldering tabs. It can operate as a standalone unit or be integrated into a multi-machine line for sequential processing. Target applications include automotive electronics, renewable energy, industrial controls, home appliances, and rail transportation.
Highlights
• Automatic thimble module replacement, solving the problem of large differences in chip sizes;
• Automatic wafer exchange and film expansion, compatible with 8" ~ 12" wafers;
• Customized feeding platform supporting four feeding methods: blue film, tray, feeder, and vibratory bowl; with automatic cutting and shaping of soldering tabs;
• Six sets of nozzles designed for large size differences, with automatic nozzle switching.
Technical Parameters
| Parameter Name | Parameter Values |
| Cycle Time | 4000ms (Dependent on product) |
| XY Placement Accuracy | ±10μm @ 3σ (Equipment accuracy, actual product accuracy depends on incoming materials) |
| Theta Range | ±1°@3σ |
| Force Control | 20g-300g |
| Die Size | 0.15×0.15mm-15×15mm |
| Die Thickness | Thickness: ≥70um |
| NTC | Tape & Reel, Electronic Feeder |
| Capacity | 2000-4000 pcs/h (Depending on jig matrix density) |
| Magazine | 4 inch Gel-PAK,Wafer-PAK (Customizable) |
| Wafer Size | 12-inch (Backward compatible with 10-inch, 8-inch) |
| Auto Theta Calibration | ±10° |
| Conveyor Width | 500*350mm (Customizable) |
| PR System | 256 Gray Levels |
| Resolution | 1920pixel×2560pixel (Customizable) |
| PR Accuracy | 5M(1920×2560pixel)FOV(16mm;×1,×2,×4) |
| Dimensions | 1600×1250×2000mm (L×W×H) |
| Weight | 2000kg |
Company Details
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
5000000-8000000
Employee Number:
5000~6000
Ecer Certification:
Verified Supplier
Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld... Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld...
Get in touch with us
Leave a Message, we will call you back quickly!