| Packaging Details | carton box/wooden box |
| Payment Terms | T/T |
| Applicable Size | Customizable according to product size |
| Laser | Cutting: UW-Ps-100; Splitting: UW-915-200 |
| Applicable Thickness | 1-8 mm (customizable) |
| Machine Dimensions | 1800*1400*2300mm |
| Loading & Unloading Method | Manual loading & unloading, connectable with upper and lower production lines |
| Brand Name | UW |
| Certification | CE ISO |
View Detail Information
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Product Specification
| Packaging Details | carton box/wooden box | Payment Terms | T/T |
| Applicable Size | Customizable according to product size | Laser | Cutting: UW-Ps-100; Splitting: UW-915-200 |
| Applicable Thickness | 1-8 mm (customizable) | Machine Dimensions | 1800*1400*2300mm |
| Loading & Unloading Method | Manual loading & unloading, connectable with upper and lower production lines | Brand Name | UW |
| Certification | CE ISO | ||
| High Light | Perovskite Layer Laser Scribing Machine ,Perovskite Layer Cutting And Breaking Machine | ||
Equipment Introduction
Adopting self-developed lasers and optical path structures, this equipment is designed for scribing perovskite and edge cleaning of the perovskite layer. It first uses ultrafast laser for cutting and modification, followed by CO₂ laser for wafer separation, achieving high-quality processing with no chipping and no cracks.
Highlights
・Adopts self-developed picosecond laser for cutting and self-developed semiconductor laser for splitting, equipped with an integrated UW cutting & splitting optical output head.
・The whole machine features a modular and flexible design with simple operation.
・Equipped with an auto-focusing and alignment vision module for accurate identification and positioning.
・Extremely minimal chipping after splitting, no micro-cracks, high cutting quality and high processing efficiency.
Technical Parameters
| Equipment Performance | Specifications |
| Operation Mode | Compatible with both manual and automatic production modes |
| Applicable Size | Customizable according to product size |
| Laser | Cutting: UW-Ps-100; Splitting: UW-915-200 |
| Optical System | Equipped with UW self-developed integrated cutting & splitting optical output head |
| Applicable Thickness | 1-8 mm (customizable) |
| Loading & Unloading Method | Manual loading & unloading, connectable with upper and lower production lines |
| Chipping Size | <5μm |
| Straightness | ±5μm |
| Machine Dimensions | 1800*1400*2300mm |
Company Details
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
5000000-8000000
Employee Number:
5000~6000
Ecer Certification:
Verified Supplier
Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld... Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld...
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