United Winners Laser Co., Ltd
| Packaging Details | carton box/wooden box |
| Payment Terms | T/T |
| Loading & Unloading Mode | AGV robot docking |
| Applicable Cell Thickness | 150±50μm |
| Laser Processing Accuracy | PT accuracy ≤ ±15 μm, line spacing accuracy ≤ ±10 μm |
| Fragmentation Rate | ≤ 0.03% @210*210mm |
| Configuration | Dual-track 4-head or dual-track 2-head |
| Brand Name | UW |
| Certification | CE ISO |
View Detail Information
Explore similar products
Auto Solar Cell UW Laser Assisted Sintering System LIM Adjustable Spot Size
Multi Functional Photovoltaic Laser Equipment BC Battery Laser Film Opening
Modular Design Perovskite P2 P3 Laser Scribing Machine High Accurate Position
Perovskite P1 P4 Laser Scribing And Edge Cleaning Machine Modular Flexible
Product Specification
| Packaging Details | carton box/wooden box | Payment Terms | T/T |
| Loading & Unloading Mode | AGV robot docking | Applicable Cell Thickness | 150±50μm |
| Laser Processing Accuracy | PT accuracy ≤ ±15 μm, line spacing accuracy ≤ ±10 μm | Fragmentation Rate | ≤ 0.03% @210*210mm |
| Configuration | Dual-track 4-head or dual-track 2-head | Brand Name | UW |
| Certification | CE ISO | ||
| High Light | Backside Poly Laser Thinning Machine ，Laser Thinning Machine For TOPCon Cells | ||
Equipment Introduction
The laser beam irradiates the PSG surface and penetrates into the Poly layer, where the surface of the Poly layer absorbs photon energy and converts it into heat, causing thermal expansion on the Poly layer surface; the force generated by the expansion destroys the PSG structure and significantly reduces its compactness, so the modified PSG can be removed by alkaline cleaning after laser treatment.
After the laser selectively acts on the PSG in non-metallic regions, the PSG, Poly and SiO₂in non-grid regions can be sequentially removed by controlling the alkaline cleaning time, etching down to 1-4 μm into the silicon substrate; the Poly in metallic regions is retained to form a Poly-Finger structure, achieving an efficiency gain of 0.15% at the cell level and mainly an improvement in bifaciality at the module level.
Highlights
» Multiple auxiliary functions to improve process performance
• Under-platform cooling system avoids high-temperature interference and delivers better process stability;
• Equipped with a dedicated dust removal hood with blowing-supping convection for higher cleanliness (patented);
• Supports various inspection functions including fragment detection, crack detection, and AOI inspection.
» Ingenious design to reduce transport defects
• Custom slotted belt and direct motor connection ensure higher stability and effectively prevent dust contamination;
• New flat belt effectively avoids defects such as scratches and indentations;
• Air knife on the jig removes fragments and prevents hidden cracks.
» Ingenious design to reduce transport defects
• Custom slotted belt and direct motor connection ensure higher stability and effectively prevent dust contamination;
• New flat belt effectively avoids defects such as scratches and indentations;
• Air knife on the jig removes fragments and prevents hidden cracks.
» Laser processing for various film structures
• Diverse technical routes and mask layer materials;
• Multiple customized laser sources to maximize matching with process requirements.
» Laser processing for various film structures
• Diverse technical routes and mask layer materials;
• Multiple customized laser sources to maximize matching with process requirements.
» Universal design with high compatibility
• Loading & unloading unit supports multiple feeding methods and various cassette sizes;
• Lifting-rotating structure with unique temporary storage position for empty cassettes;
• Supports various inspection functions including fragment detection, crack detection, and AOI inspection.
Technical Parameters
| Equipment Performance | Specifications |
| Operation Mode | Compatible with 230×230 mm and smaller sizes (half cells can be customized) |
| Applicable Cell Size | Compatible with 230×230 mm and smaller sizes (half cells can be customized) |
| Applicable Cell Thickness | 150±50μm |
| Loading & Unloading Mode | AGV robot docking |
| Laser Processing Accuracy | PT accuracy ≤ ±15 μm, line spacing accuracy ≤ ±10 μm |
| Vision Inspection & Positioning Accuracy | Positioning accuracy ≤ ±50 μm; single-camera fragment detection with 20 MP camera, supporting chipping, corner breakage and fragment detection |
| Typical Machine Capacity (Dual-track, 4-head) | PSG laser thinning: 9000 UPH/174 busbars @ 182×182 mm |
| Fragmentation Rate | ≤ 0.03% @210*210mm |
| Configuration | Dual-track 4-head or dual-track 2-head |
| Spot Size | Square flat-top homogenized spot, size 100–500 μm optional & customizable |
Company Details
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
5000000-8000000
Employee Number:
5000~6000
Ecer Certification：
Verified Supplier
Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld... Founded in 2005, United Winners Laser Co., Ltd. is a leading supplier of laser welding equipment and intelligent manufacturing solutions in China. It is a national high-tech enterprise and a listed company on the SSE Star Market, specializing in R&D, production, and sales of precision laser weld...
Get in touch with us
Leave a Message, we will call you back quickly!