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High Precision Micro Focus X‑ray Inspection Machine For Semiconductor PCB Solder Joint Defect Non‑destructive Check
WELLMAN X-ray Inspection Equipment X6800
Advanced X-ray inspection system designed for high-precision non-destructive testing of semiconductor components, PCB solder joints, and electronic assemblies.
Key Advantages
130×130 mm large-area digital FPD detector
520×520mm table with 15KG load capacity
Easy to operate with 2 hours training
Closed tube with long service time and maintenance-free operation
Programmable procedures for automated batch inspection
Automatic navigation window moves to anywhere you click
FPD can tilt 60 degree without sacrificing magnification
Working Principle
Working principle diagram showing X-ray source, sample placement, and detector configuration
Hardware Specifications
X-ray Source
Type
Closed, microfocus
Max Tube Voltage
90kV (optional)
Max Tube Current
200μA
Focal Spot Size
5μm
Function
Auto preheat
Flat Panel Detector
Effective Area
130mm×130mm
Pixel Size
85μm
Resolution
1536×1536
Frame Rate
20fps
Table
Size
420mm×420mm
Detectable Area
400mm×400mm
Max Load
15kg
Equipment
Magnification
Geometry 150X | System 1500X
Inspection Speed
Max 3.0s/point
Dimensions
1100mm (L) × 1000mm (W) × 1600mm (H)
Weight
1000kg
Power Supply
AC110-220V 50/60HZ
Max Power
1300W
Industrial PC
Intel I5 CPU, 8G RAM, 240GB SSD
Displayer
24" HDMI LCD
Safety Features
Emergency Stop
Located next to operation position for immediate power cutoff
Tube Protection
Software prevents leaving without closing X-ray tube
Radiation Leakage
No leakage
Lead Glass Observation Window
Transparent lead glass window shields radiation to observe internal status
Window and Back Door Safety Interlock
X-ray tube powers off immediately when window or door opens
Software Functions
Full control via keyboard and mouse; real-time X-ray tube voltage/current adjustment
Adjustable brightness contrast and gain for clear imaging
One-click table movement via navigation window
Save and recall product inspection parameters
Automatic calculation of solder voids rate area and perimeter
Distance angle radius perimeter and through-hole soldering rate measurement
Manual point setting array scanning and auto feature recognition
Measurement Functions
Distance
Click A and B points as baseline, then click C point to measure vertical distance
Distance Rate
Mostly used to measure soldering rate of through-hole
Angle
Click A and B points as baseline, then click C point to measure angle between BA and BC rays
Radius
Click three points to determine circle and measure circumference, area and radius
Perimeter
Click two points to determine square, measure length, width and area
Application Examples
BGA Solder Bridge
BGA Solder Voids
PCB Through-Hole
IC Voids and Gold Wire
LED Solder Voids
LED Gold Wire Crack
Capacitor
Inductor
Sensor
Thyristor Surge Suppressors
Fiberglass
Cable
Diode
Steel Pipe Welding Gap
Automobile Electronics
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2018
Ecer Certification:
Verified Supplier
Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises.
Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing ... Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises.
Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing ...