| Payment Terms | L/C,Western Union,T/T |
| Supply Ability | 100000 rolls per month |
| Delivery Time | 5-8 WORKING DAYS |
| Packaging Details | Roll, Neutrial Packing or with OEM LOGO |
| Application | Semiconductor Packaging, Microelectronics, Medical Devices |
| Package | Spool |
| Corrosion Resistance | High |
| Bond Strength | High |
| Length Meters | 500/1000 |
| Product Type | Bonding Wire |
| Coating | Gold |
| Purity | 99.999% |
| Bonding Method | Ultrasonic |
| Temperature Range | -40°C to 200°C |
| Surface Finish | Bright |
| Conductivity | 98% |
| Package Size | 100 meters |
| Core Diameter | 25μm/27μm |
| Coating Thickness | 0.2 ~ 0.8μm |
| Max Temperature | 450℃ |
| Temperature Shock | -196 ~ 250℃ |
| Brand Name | WINNER |
| Model Number | MW001 |
| Certification | ISO9100 |
| Place of Origin | CHINA |
View Detail Information
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Product Specification
| Payment Terms | L/C,Western Union,T/T | Supply Ability | 100000 rolls per month |
| Delivery Time | 5-8 WORKING DAYS | Packaging Details | Roll, Neutrial Packing or with OEM LOGO |
| Application | Semiconductor Packaging, Microelectronics, Medical Devices | Package | Spool |
| Corrosion Resistance | High | Bond Strength | High |
| Length Meters | 500/1000 | Product Type | Bonding Wire |
| Coating | Gold | Purity | 99.999% |
| Bonding Method | Ultrasonic | Temperature Range | -40°C to 200°C |
| Surface Finish | Bright | Conductivity | 98% |
| Package Size | 100 meters | Core Diameter | 25μm/27μm |
| Coating Thickness | 0.2 ~ 0.8μm | Max Temperature | 450℃ |
| Temperature Shock | -196 ~ 250℃ | Brand Name | WINNER |
| Model Number | MW001 | Certification | ISO9100 |
| Place of Origin | CHINA | ||
| High Light | gold plated molybdenum wire semiconductor ,ultra fine molybdenum wire high reliability ,gold plated wire for semiconductor packaging | ||
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ready in stock with short lead time, this ultra fine wire offers high reliability and stable quality for mass production in semiconductor packaging lines.
| Items | Data |
|---|---|
| Chemical analysis (wt%) | Mo ≥ 99.9%, Au : 99.99% |
| Core wire diameter | 25μm/27μm in stock, customized |
| Coating thickness | 0.2 ~ 0.8μm |
| Max. using temperature | 450℃ |
| Anti-temperature shock | bear -196 ~ 250℃ fast cyclical impact |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Trading Company,Seller
Year Established:
2009
Total Annual:
1000000-10000000
Employee Number:
170~200
Ecer Certification:
Verified Supplier
Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified range of business including research and development, production, and sales of semiconductor packaging materials. As we focused on A Ultra-fine Coated Metal Wir... Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified range of business including research and development, production, and sales of semiconductor packaging materials. As we focused on A Ultra-fine Coated Metal Wir...
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