| Material | FR4 |
| Minimum Hole Size | 0.25 mm three sides |
| Supply Ability | 1 Million Square feet/per month |
| Minimum Line Width | 0.15 mm |
| Layer Count | 4 |
| Payment Terms | Western Union |
| Delivery Time | 8-15DAYS |
| Minimum Line Spacing | 0.15 mm |
| Board Thickness | 1.0mm |
| Copper Thickness | 1/1/1/1 oz |
| Certification | UL ,IOS9000 |
| Model Number | XSWPCB |
| Brand Name | XSW PCB |
| Place of Origin | China |
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Product Specification
| Material | FR4 | Minimum Hole Size | 0.25 mm three sides |
| Supply Ability | 1 Million Square feet/per month | Minimum Line Width | 0.15 mm |
| Layer Count | 4 | Payment Terms | Western Union |
| Delivery Time | 8-15DAYS | Minimum Line Spacing | 0.15 mm |
| Board Thickness | 1.0mm | Copper Thickness | 1/1/1/1 oz |
| Certification | UL ,IOS9000 | Model Number | XSWPCB |
| Brand Name | XSW PCB | Place of Origin | China |
| High Light | Immersion Gold Multilayer Printed Circuit Board ,Multilayer Printed Circuit Board UL | ||
| Layer Count | 4 |
| Material | FR4 |
| Board Thickness | 1.0mm |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm three sides |
| Minimum Line Width | 0.15 mm |
| Minimum Line Spacing | 0.15 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Security Products |
Product Description:
ENIG Quality: Control the gold layer thickness (0.05~0.1μm) and prevent black pad — these are the foundation of solder joint reliability. Substrate Selection: Use high-Tg, low moisture absorption materials to ensure stability in high-temperature and high-humidity environments. Environmental Adaptability: Consider temperature cycling, salt spray, vibration, and other actual working conditions of security equipment. Testability: Reserve test points to facilitate ICT/FCT inspection. Process Control: Conduct batch sampling inspection for ENIG thickness, solderability, etc.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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