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This 8-layer through-hole PCB is manufactured with a lead-free HASL (Hot Air Solder Leveling) surface finish and blue solder mask, engineered for high-reliability applications requiring precise impedance control and structural integrity. The 8-layer symmetric stackup design ensures exceptional flatness with warpage controlled to ≤0.5%, making it ideal for communication equipment, industrial control systems, automotive electronics, and precision instrumentation.
Key Manufacturing Features
8-Layer Symmetric Stackup: Precisely engineered symmetrical lamination structure ensures balanced stress distribution and superior dimensional stability, achieving warpage ≤0.5% across the entire board.
Lead-Free HASL Surface Finish: Environmentally compliant tin-lead-free hot air solder leveling with controlled tin spray thickness uniformity. Flux spray uniformity testing is performed before HASL processing. Vertical HASL air knife pressure is maintained at 0.3-0.5MPa, achieving a uniform tin thickness of 2-5μm with minimum 2μm at pin areas.
Pulse-Plated Through Holes: After PTH (Plated Through Hole) copper deposition, pulse current is applied during panel plating to ensure void-free, uniform copper deposition. Hole wall copper thickness is guaranteed ≥20μm for superior electrical and thermal conductivity.
High-Precision Etching: Outer layer etching factor is maintained at ≥3.5, ensuring sharp, well-defined trace geometries with minimal undercut for consistent impedance control across all 8 layers.
Controlled Depth Drilling: Drill bit life is limited to 2400 holes per bit with automated depth control, preventing drill wander and ensuring clean, burr-free hole walls for reliable plating adhesion.
Blue Solder Mask with High-Pressure Rinse: After blue oil development, high-pressure water rinsing thoroughly removes chemical residues from holes. Post-curing adhesion is verified by cross-cut (cross-hatch) testing achieving 5B rating per ASTM D3359.
Technical Specifications
Item
Mass Production Capability
Extreme Capability
Board Thickness Range
0.3~6.0mm
0.3~6.0mm
Exposure Alignment Accuracy
±0.015mm
±0.005mm
Minimum Annular Ring
Single side ≥0.05mm
Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)
0.05mm / 0.05mm
0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)
0.05mm / 0.05mm
0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)
0.075mm / 0.075mm
0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)
±0.005mm
±0.005mm
Etching Tolerance (1/2oz base copper)
±0.005mm
±0.005mm
Etching Tolerance (1oz base copper)
±0.0075mm
±0.0075mm
Gold Finger Total Pitch Tolerance
<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...