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Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Electronic Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB
China Electronic Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB

  1. China Electronic Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB

Electronic Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB

  1. MOQ: 1
  2. Price: Negotiable
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Material FR4 TG150
Delivery Time 8-15DAYS
Minimum Hole Size 0.2mm (Mechanical Drill)
Payment Terms Western Union
Solder Mask Color Blue
Supply Ability 1 Million Square feet/per month
Board Thickness 1.6mm
Copper Thickness 1/2/4 oz
Minimum Line Width 0.1mm
Layer Count 8 Layers
Model Number XSWPCB
Certification UL ,IOS9000
Place of Origin China
Brand Name XSW PCB

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  1. Product Details
  2. Company Details

Product Specification

Material FR4 TG150 Delivery Time 8-15DAYS
Minimum Hole Size 0.2mm (Mechanical Drill) Payment Terms Western Union
Solder Mask Color Blue Supply Ability 1 Million Square feet/per month
Board Thickness 1.6mm Copper Thickness 1/2/4 oz
Minimum Line Width 0.1mm Layer Count 8 Layers
Model Number XSWPCB Certification UL ,IOS9000
Place of Origin China Brand Name XSW PCB
High Light Electronic Printed Circuit Board 1.6mm8 Layer PCB AssemblyFr4 2oz Copper PCB
Electric Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB Assembly
Key Specifications
Layer Count 8 Layers
Material FR4
Board Thickness 1.6mm
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.1mm
Minimum Line Spacing 0.1mm
Solder Mask Color Blue
Surface Finish Lead-Free HASL (Tin Spray)
Application Field

Industrial Control and Automation Systems

This 8-layer through-hole PCB is manufactured with a lead-free HASL (Hot Air Solder Leveling) surface finish and blue solder mask, engineered for high-reliability applications requiring precise impedance control and structural integrity. The 8-layer symmetric stackup design ensures exceptional flatness with warpage controlled to ≤0.5%, making it ideal for communication equipment, industrial control systems, automotive electronics, and precision instrumentation.

 

Key Manufacturing Features

  • 8-Layer Symmetric Stackup: Precisely engineered symmetrical lamination structure ensures balanced stress distribution and superior dimensional stability, achieving warpage ≤0.5% across the entire board.
  • Lead-Free HASL Surface Finish: Environmentally compliant tin-lead-free hot air solder leveling with controlled tin spray thickness uniformity. Flux spray uniformity testing is performed before HASL processing. Vertical HASL air knife pressure is maintained at 0.3-0.5MPa, achieving a uniform tin thickness of 2-5μm with minimum 2μm at pin areas.
  • Pulse-Plated Through Holes: After PTH (Plated Through Hole) copper deposition, pulse current is applied during panel plating to ensure void-free, uniform copper deposition. Hole wall copper thickness is guaranteed ≥20μm for superior electrical and thermal conductivity.
  • High-Precision Etching: Outer layer etching factor is maintained at ≥3.5, ensuring sharp, well-defined trace geometries with minimal undercut for consistent impedance control across all 8 layers.
  • Controlled Depth Drilling: Drill bit life is limited to 2400 holes per bit with automated depth control, preventing drill wander and ensuring clean, burr-free hole walls for reliable plating adhesion.
  • Blue Solder Mask with High-Pressure Rinse: After blue oil development, high-pressure water rinsing thoroughly removes chemical residues from holes. Post-curing adhesion is verified by cross-cut (cross-hatch) testing achieving 5B rating per ASTM D3359.
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

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  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

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