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{"title":"FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules","imgUrl":"https:\/\/img.chinax.com\/nimg\/bc\/c0\/cdace5d218b46e169b066a0b4331-200x200-1\/fr4_tg150_6_layer_enig_pcb_board_0_1mm_line_width_for_mobile_phone_modules.jpg","attrs":{"Certification":"UL ,IOS9000","Material":"FR4 TG150","Minimum Hole Size":"0.2mm","Model Number":"XSWPCB"}}
{"title":"8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width","imgUrl":"https:\/\/img.chinax.com\/nimg\/c7\/d6\/bb25d494df041982377b62491cb2-200x200-1\/8_layer_osp_coating_black_communication_pcb_fr4_tg150_with_0_12mm_line_width.jpg","attrs":{"Material":"FR4 TG150","Minimum Hole Size":"0.2mm","Place of Origin":"China","Minimum Line Width":"0.1mm"}}
{"title":"Precision Communication PCB For Wireless Module Integration & Iot Connectivity","imgUrl":"https:\/\/img.chinax.com\/nimg\/36\/14\/77d032de485553acf8437716e238-200x200-1\/precision_communication_pcb_for_wireless_module_integration_26_iot_connectivity_solutions.jpg","attrs":{"Material":"FR4-TG140","Minimum Hole Size":"0.2 mm","Price":"Negotiable","Certification":"UL ,IOS9000"}}
{"title":"High Speed Communication PCB Board 18 Layer High TG FR4 PCB","imgUrl":"https:\/\/img.chinax.com\/nimg\/f8\/3d\/12811878f126f6f0b9a1ae81694e-200x200-1\/high_speed_communication_pcb_board_18_layer_high_tg_fr4_pcb.jpg","attrs":{"Layer Count":"18L","Copper Thickness":"1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1\/1 oz","Certification":"UL ,IOS9000","Place of Origin":"China"}}
{"title":"4 Layer Lead Free HASL Communication PCB FR4 TG150 1.6mm Printed Circuit Board","imgUrl":"https:\/\/img.chinax.com\/nimg\/cc\/0d\/2810559572c16d235a70335737ca-200x200-1\/4_layer_lead_free_hasl_communication_pcb_fr4_tg150_1_6mm_printed_circuit_board_assembly.jpg","attrs":{"Material":"FR4 TG150","Place of Origin":"China","Supply Ability":"1 Million Square feet\/per month","Minimum Hole Size":"0.2"}}
{"title":"4 Layer Cell Phone Communication PCB Circuit Board FR4 TG170 With Immersion Gold","imgUrl":"https:\/\/img.chinax.com\/nimg\/ae\/96\/8680b5f52df39f89aed7342eae81-200x200-1\/4_layer_cell_phone_communication_pcb_circuit_board_fr4_tg170_with_immersion_gold.jpg","attrs":{"Material":"FR4 TG170","Minimum Hole Size":"0.2 mm","Minimum Line Spacing":"0.1 mm","Payment Terms":"Western Union"}}
{"title":"Security Grade 4 Layer FR4 Black Solder Mask PCB With BGA Gold Fingers","imgUrl":"https:\/\/img.chinax.com\/nimg\/f3\/df\/cac760b92bd1c393cc0d606c5b0f-200x200-1\/security_grade_4_layer_fr4_black_solder_mask_pcb_with_bga_gold_fingers.jpg","attrs":{"Material":"FR4","Minimum Hole Size":"0.2 mm","Place of Origin":"China","Supply Ability":"1 Million Square feet\/per month"}}
This advanced 6-layer mobile phone module features ENIG surface finish and blue solder mask, specifically designed for mobile communication applications with high-frequency performance requirements.
Key Specifications
Specification
Value
Layer Count
6 Layers
Material
FR4
Board Thickness
1.2mm
Copper Thickness
1/1/1/1 oz
Minimum Hole Size
0.2mm
Minimum Line Width
0.1mm
Minimum Line Spacing
0.1mm
Solder Mask Color
Blue
Surface Finish
ENIG
Application Field
Mobile Communication
Critical Production Processes
Inner layer core board undergoes browning treatment for uniform film density
CCD automatic alignment exposure with ±25μm interlayer accuracy
100% AOI inspection and line width measurement after inner layer etching
Hot oil press lamination with ±2°C temperature uniformity and vacuum assist
X-Ray measurement with ≤75μm interlayer misalignment control
Scanning acoustic microscopy for delamination and void detection
High-precision CNC drilling with backup board structures
Desmearing and potassium permanganate treatment before electroless copper
Vacuum screen printer for solder mask application
Plasma roughening before ENIG for enhanced adhesion
Comprehensive testing including tape pull, bend testing, and TDR impedance
Technical Specifications
Item
Mass Production Capability
Extreme Capability
Board Thickness Range
0.3~6.0mm
0.3~6.0mm
Exposure Alignment Accuracy
±0.015mm
±0.005mm
Minimum Annular Ring
Single side ≥0.05mm
Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)
0.05mm / 0.05mm
0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)
0.05mm / 0.05mm
0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)
0.075mm / 0.075mm
0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)
±0.005mm
±0.005mm
Etching Tolerance (1/2oz base copper)
±0.005mm
±0.005mm
Etching Tolerance (1oz base copper)
±0.0075mm
±0.0075mm
Gold Finger Total Pitch Tolerance
<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...