China factories

Chat Now Send Email
China factory - Shenzhen Xunsiwei Circuit Co., Ltd.

Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
  1. Home
  2. Products
  3. About Us
  4. Contact Us

Leave a Message

we will call you back quickly!

Submit Requirement
China 8 Layer Through Hole PCB Assembly For Medical Devices
China 8 Layer Through Hole PCB Assembly For Medical Devices

  1. China 8 Layer Through Hole PCB Assembly For Medical Devices

8 Layer Through Hole PCB Assembly For Medical Devices

  1. MOQ: 1
  2. Price: Negotiable
  3. Get Latest Price
Material FR-4
Delivery Time 8-15DAYS
Surface Finish ENIG
Payment Terms Western Union
Supply Ability 1 Million Square feet/per month
Board Thickness 1.6mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Layer Count 8-Layer
Model Number XSWPCB
Certification UL ,IOS9000
Place of Origin China
Brand Name XSW PCB

View Detail Information

Inquiry by Email Get Latest Price
Chat online Now Ask for best deal
  1. Product Details
  2. Company Details

Product Specification

Material FR-4 Delivery Time 8-15DAYS
Surface Finish ENIG Payment Terms Western Union
Supply Ability 1 Million Square feet/per month Board Thickness 1.6mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz Layer Count 8-Layer
Model Number XSWPCB Certification UL ,IOS9000
Place of Origin China Brand Name XSW PCB
High Light 8 Layer Through Hole PCB AssemblyMedical Through Hole PCB Assembly
8 Layer Through-hole PCBA for Medical Devices Medical Through-Hole PCBA Assembly

Medical-grade 8-layer through-hole immersion gold and blue oil solder mask, controlling high aspect ratio perforation, gold layer density, and blue oil insulation performance. The board is 1.6mm thick with an 8:1 aspect ratio. Drilling utilizes a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls and a roughness ≤18μm. Electroplating requires highly dispersing additives, with an internal copper thickness ≥20μm and a tolerance ≤4μm, and a copper thickness ratio at the hole opening to the bottom ≤1.5:1. Plasma cleaning is performed before immersion gold plating, ensuring a dense, microporous gold layer. Salt spray testing shows no corrosion for ≥96 hours, and the internal stress of the nickel layer is controlled between 80-120MPa. The blue oil requires high insulation, with a dielectric strength ≥40kV/mm. After development, high-pressure water washing removes residue, followed by curing at 150℃ for 70 minutes. Each batch undergoes CAF testing (100V, 85℃/85%RH, 500h), with an insulation resistance ≥100MΩ. Ion contamination ≤0.3μg/cm², no stratification observed in ultrasonic scanning after thermal shock, and full-process MES recording.

Key Specifications
Layer Count 8-Layer
Material FR-4
Board Thickness 1.6 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.12 mm
Minimum Line Spacing 0.12 mm
Solder Mask Color Blue
Surface Finish   ENIG

 

Product Description

High Aspect Ratio Through-Hole Technology

  • Board thickness: 1.6mm.
  • Aspect ratio up to 8:1.
  • Supports complex multilayer interconnections.

Precision Double-Sided Drilling Process

  • Double-sided drilling improves hole alignment accuracy.
  • Eliminates glass fiber protrusion inside plated holes.
  • Enhances long-term plated-through-hole reliability.

Superior Hole Wall Quality

  • Hole wall roughness ≤18μm.
  • Optimized for high-quality copper deposition.
  • Improved mechanical and electrical performance.

Uniform Through-Hole Copper Plating

  • Average hole copper thickness ≥20μm.
  • Thickness variation ≤4μm.
  • Ensures consistent conductivity and durability.

High Throwing Power Electroplating Technology

  • Specialized plating additives improve copper distribution.
  • Hole entrance-to-bottom copper ratio ≤1.5:1.
  • Reliable metallization for deep through holes.

Premium ENIG Surface Finish

  • Plasma cleaning before ENIG processing.
  • Dense, pore-free immersion gold layer.
  • Excellent solderability and oxidation resistance.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement