Shenzhen Xunsiwei Circuit Co., Ltd.
| Material | FR-4 TG150 |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Spacing | 0.1 mm |
| Supply Ability | 1 Million Square feet/per month |
| Payment Terms | Western Union |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1 Oz |
| Delivery Time | 8-15DAYS |
| Minimum Line Width | 0.12mm |
| Layer Count | 6 |
| Brand Name | XSW PCB |
| Certification | UL ,IOS9000 |
| Model Number | XSWPCB |
| Place of Origin | China |
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Product Specification
| Material | FR-4 TG150 | Minimum Hole Size | 0.2 mm |
| Minimum Line Spacing | 0.1 mm | Supply Ability | 1 Million Square feet/per month |
| Payment Terms | Western Union | Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1 Oz | Delivery Time | 8-15DAYS |
| Minimum Line Width | 0.12mm | Layer Count | 6 |
| Brand Name | XSW PCB | Certification | UL ,IOS9000 |
| Model Number | XSWPCB | Place of Origin | China |
| High Light | Vehicle Communication Circuit Board ，6 Layer Communication Circuit Board | ||
6-layer immersion gold vehicle communication
| Layer Count | 6-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1 Oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.12mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Blue |
| Surface Finish | ENIG |
| Application Field | Industrial control system |
Product Description:
1. Material Selection
Substrate: High Tg material (glass transition temperature ≥150°C) is selected to meet heat resistance and CAF (Conductive Anodic Filament) resistance requirements.
Copper Foil: Low-roughness copper foil is used in high-frequency signal areas to reduce signal transmission loss.
Surface Finish: Immersion gold (ENIG) process is preferred, with precise control of gold layer thickness (0.15-0.2μm for RF areas) to ensure solderability, oxidation resistance, and low contact resistance.
2. Precision Circuit Fabrication
Due to the high integration level of vehicle-mounted terminals, LDI (Laser Direct Imaging) technology is adopted to achieve high-precision circuit pattern transfer, with line width/line spacing controlled below 50μm. Line width tolerance is strictly controlled (±5μm or ±0.02mm) to avoid signal integrity issues caused by over-etching or incomplete etching.
3. Multilayer Board Lamination
Supports 4-16 layers (including HDI/any-layer) high-density interconnect design. High-precision alignment systems and vacuum lamination processes are employed to strictly control layer-to-layer registration (layer misalignment ≤10% of hole diameter), ensuring multilayer board bonding strength and reliability.
4. Impedance Control
RF communication (4G/5G, V2X) and high-speed digital signals (Ethernet) in vehicle-mounted terminals have strict impedance control requirements. Precise control of line width, dielectric thickness, and dielectric constant is required to ensure characteristic impedance tolerances (e.g., 50Ω single-ended, 100Ω differential) within ±5% to ±10%.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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