| Material | FR4 TG170 |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Spacing | 0.12 mm |
| Board Thickness | 1.6 mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Supply Ability | 1 Million Square feet/per month |
| Delivery Time | 8-15DAYS |
| Minimum Line Width | 0.12 mm |
| Payment Terms | Western Union |
| Layer Count | 6 |
| Place of Origin | China |
| Model Number | XSWPCB |
| Certification | UL ,IOS9000 |
| Brand Name | XSW PCB |
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Product Specification
| Material | FR4 TG170 | Minimum Hole Size | 0.2 mm |
| Minimum Line Spacing | 0.12 mm | Board Thickness | 1.6 mm |
| Copper Thickness | 1/1/1/1/1/1 oz | Supply Ability | 1 Million Square feet/per month |
| Delivery Time | 8-15DAYS | Minimum Line Width | 0.12 mm |
| Payment Terms | Western Union | Layer Count | 6 |
| Place of Origin | China | Model Number | XSWPCB |
| Certification | UL ,IOS9000 | Brand Name | XSW PCB |
| High Light | 6 Layer Immersion Gold PCB ,Immersion Gold PCB FR4 TG170 ,Servo Driver Board FR4 TG170 | ||
| Layer Count | 6 |
| Material | FR4 TG170 |
| Board Thickness | 1.6 mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.12 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Industrial servo driver |
Product Description:
1. High-Tg Substrate & Thick Copper: Thermal Management Servo drives generate significant heat during operation. High-Tg Material: Tg ≥150°C (≥170°C recommended, e.g., Sunlord S1130) to prevent deformation/softening at high temperatures. Thick Copper: 2oz–3oz copper for main current loops (power transistors, motor drive lines). Compared to 1oz copper, 2oz copper increases heat dissipation area by ≈65% and reduces pad temperature by ≈35°C.
2. ENIG Process Control: Solderability & Reliability ENIG provides flat pads and good conductivity; precise control is critical. Nickel Layer: Temperature 82–88°C, pH 4.6–5.2. Deviation causes uneven crystallization, poor adhesion, and "black pad" defects. Gold Layer Thickness: 0.1–0.5μm recommended. Excessive gold causes "gold embrittlement" and cracks after reflow. Adhesion: Proper cleaning and micro-etching before ENIG ensure nickel-copper adhesion, surviving multiple reflow cycles without blistering or peeling.
3. Precision Circuitry & Impedance Control: Signal Integrity Servo drives integrate PWM, encoder feedback, and other high-precision signals. Line Width/Spacing: LDI technology for high-density areas, line width tolerance ≤±15μm. Impedance Matching: 50Ω single-ended / 100Ω differential for high-speed signals (encoder, communication interfaces), tolerance ≤±10% to prevent reflection and distortion. Length Matching & Isolation: Length matching for critical signals; strict physical isolation between high-current power lines and low-level control signals with ground isolation bands to prevent crosstalk.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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