Shenzhen Xunsiwei Circuit Co., Ltd.
| Material | FR-4 High-Tg 170 |
| Solder Mask Color | Matte Black |
| Supply Ability | 1 Million Square Feet per Month |
| Impedance Control | +/-10% |
| Delivery Time | 8-15 Days |
| Min Laser Drill (Microvia) | 0.1 mm |
| Payment Terms | T/T, Western Union, PayPal |
| Layer Count | 6-Layer (1+4+1 HDI) |
| Surface Finish | ENIG |
| Outer / Inner Copper | 1 oz / 0.5 oz |
| Packaging Details | Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton |
| Board Thickness | 1.0 mm (Customizable) |
| Min Line Width / Spacing | 0.05 mm / 0.05 mm |
| Certification | UL, ISO9001 |
| Brand Name | XSW PCB |
| Model Number | XSW-HDI6 |
| Place of Origin | China |
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Product Specification
| Material | FR-4 High-Tg 170 | Solder Mask Color | Matte Black |
| Supply Ability | 1 Million Square Feet per Month | Impedance Control | +/-10% |
| Delivery Time | 8-15 Days | Min Laser Drill (Microvia) | 0.1 mm |
| Payment Terms | T/T, Western Union, PayPal | Layer Count | 6-Layer (1+4+1 HDI) |
| Surface Finish | ENIG | Outer / Inner Copper | 1 oz / 0.5 oz |
| Packaging Details | Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton | Board Thickness | 1.0 mm (Customizable) |
| Min Line Width / Spacing | 0.05 mm / 0.05 mm | Certification | UL, ISO9001 |
| Brand Name | XSW PCB | Model Number | XSW-HDI6 |
| Place of Origin | China | ||
| High Light | 6 Layer HDI PCB Fabrication ，0.05mm Fine Line PCB Capability ，Drone Flight Controller PCB | ||
This 6-layer HDI multilayer PCB is engineered for drone flight controller and inertial navigation modules where dense routing, high-speed signal integrity and low board weight are mission critical. The board is built on high-Tg FR-4 with laser-drilled microvias, LDI fine-line imaging and controlled impedance, delivering a compact, high-reliability interconnect platform for UAV electronics.
| Layer Count | 6-Layer (1+4+1 HDI stack-up) |
| Material | FR-4 High-Tg 170 (Optional: Rogers / high-frequency) |
| Board Thickness | 1.0 mm (Customizable 0.6-2.0 mm) |
| Outer / Inner Copper | 1 oz / 0.5 oz |
| Min Line Width / Spacing | 0.05 mm / 0.05 mm |
| Min Laser Drill (Microvia) | 0.1 mm |
| Impedance Control | ±10% (single-ended & differential) |
| Solder Mask | Matte Black |
| Surface Finish | ENIG (Immersion Gold) |
Blind and buried vias are laser-drilled down to 0.1 mm with strict aspect-ratio control, preventing barrel cracking and ensuring reliable copper plating in the microvia walls.
Laser Direct Imaging (LDI) is applied to resolve 0.05 mm traces, holding registration precision to avoid open circuits and copper shorts on densely populated routing areas.
CCD target punching and x-ray alignment keep 6-layer registration within ±0.025 mm, eliminating layer offset that would otherwise ruin impedance and via connectivity.
Stack-up and trace geometry are simulated and verified to hold ±10% impedance, protecting signal integrity between the flight controller MCU, IMU and communication links.
Multiple lamination cycles are executed without resin starvation or delamination, preserving dielectric thickness consistency across every HDI layer.
| Application | Drone flight controller, IMU, gimbal and navigation boards |
| Assembly Service | SMT / BGA / QFN / fine-pitch BGA assembly available |
| Prototype Lead Time | 3-5 days for prototype, 8-15 days for mass production |
| Testing | Flying probe, impedance coupon, AOI and 100% electrical test |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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