Shenzhen XinZhanHong Technology Co., Ltd.
| Type | single sided pcb |
| Base Material | CME1/FR-4/Aluminum/Copper/Flex/Rogers/Polyimide |
| Copper Thickness | 1.0oz- 15.0oz |
| Board Thickness | 0.1mm |
| Min. Hole Diameter | 3mil |
| Min. Line Width | 0.075mm |
| Min. Line Spacing | 0.075mm |
| Surface Finishing | osp |
| Board Size | Custom |
| Product name | XZH single-sided pcb |
| Layer | 1L |
| Application | Comsumer Electronics |
| Test | 100%E-testing |
| Certificate | ROSH. ISO9001. UL |
| Service | EMS.ODM.OEM |
| Silkscreen Color | Request |
| MOQ | 1 |
| Shape | Customised Required |
| PCBA service | Turnkey Assembly PCBA Service |
| Model Number | XZH single-sided pcb |
| Place of Origin | Guangdong, China |
| Brand Name | XZH |
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Product Specification
| Type | single sided pcb | Base Material | CME1/FR-4/Aluminum/Copper/Flex/Rogers/Polyimide |
| Copper Thickness | 1.0oz- 15.0oz | Board Thickness | 0.1mm |
| Min. Hole Diameter | 3mil | Min. Line Width | 0.075mm |
| Min. Line Spacing | 0.075mm | Surface Finishing | osp |
| Board Size | Custom | Product name | XZH single-sided pcb |
| Layer | 1L | Application | Comsumer Electronics |
| Test | 100%E-testing | Certificate | ROSH. ISO9001. UL |
| Service | EMS.ODM.OEM | Silkscreen Color | Request |
| MOQ | 1 | Shape | Customised Required |
| PCBA service | Turnkey Assembly PCBA Service | Model Number | XZH single-sided pcb |
| Place of Origin | Guangdong, China | Brand Name | XZH |
| High Light | Customized PCB Manufacturing Service ，PCB Manufacturing Service Single Sided ，FR-4 Pcb Circuit Board | ||
| Description | Technology & Capabilities | | | | | ||||
| 1. Quality Grade | Standard IPC 2-3 | | | | | ||||
| 2. Number of Layers | 1 - 32layers | | | | | ||||
| 3. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | | | | | ||||
| 4. Surface Finish | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | | | | | ||||
| 5. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | | | | | ||||
| 6. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | | | | | ||||
| 7. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | | | | | ||||
| 8. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (＜0.10mm) | | | | | ||||
| 9. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | | | | | ||||
| 10. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI＜0.10mm via | | | | | ||||
| 11. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | | | | | ||||
| 12. Solder Mask | Liquid Photo- Image (LPI) | | | | | ||||
| 13. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | | | | | ||||
| 14. Capacity | 100 k㎡ output monthly | | | | | ||||
| Item | Capability |
| Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Layers | 1-4 Layers(Alunimum), 1-32 layers(FR4) |
| Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
| Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
| Board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
| Board Thickness | 0.4mm - 4.0mm |
| Thickness Tolerance | +/-10% |
| Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
| Min Hole | 0.2 mm |
| Min Track Width | 0.2mm (8mil) |
| Min Track Gap | 0.2mm (8mil) |
| Min SMD Pad Pitch | 0.2mm (8mil) |
| Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
| Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Legend Color | Black, White etc |
| Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
| Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned |
| Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
| SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray |
| Stencils | Laser-cut stainless steel |
| Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |
| | Sample Lead time | Mass production lead time | ||
| Single sided PCB | 1~3 days | 4~7 days | ||
| Double sided PCB | 2~5 days | 7~10 days | ||
| Multilayer PCB | 7~8 days | 10~15 days | ||
| PCB Assembly | 8~15 days | 2~4 weeks | ||
| Delivery time | 3-7 days | 3-7 days | ||
| Package: Anti-static Package with carton | | | ||
Company Details
Business Type:
Manufacturer
Year Established:
2014
Total Annual:
100000-5000000
Employee Number:
50~200
Ecer Certification：
Active Member
Shenzhen XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance system and advanced test-analyzed instruments. Our factory is a professional manufacturer for PCB. which is widely applicable to consumer electronics, telecommuni... Shenzhen XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance system and advanced test-analyzed instruments. Our factory is a professional manufacturer for PCB. which is widely applicable to consumer electronics, telecommuni...
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