| Supply Ability | 1000peice/week |
| Delivery Time | 10-15Business days |
| Material Specification | Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); optional nickel or gold plating. |
| Dimensional Tolerances | Critical Features – ±0.005 mm (device alignment); Overall Body – ±0.02 mm |
| Flatness/Coplanarity | ≤0.01 mm across seating surface (ensures uniform contact pressure). |
| Pin/Lead Channel Width & Depth | Width – ±0.003 mm; Depth – ±0.005 mm (adjustable for lead deflection). |
| Pin/Lead Channel Pitch Accuracy | ±0.005 mm (fine-pitch ICs), ±0.01 mm (standard). |
| Brand Name | Yiding |
| Certification | ISO 9001 |
| Place of Origin | Guangdong, China |
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Product Specification
| Supply Ability | 1000peice/week | Delivery Time | 10-15Business days |
| Material Specification | Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); optional nickel or gold plating. | Dimensional Tolerances | Critical Features – ±0.005 mm (device alignment); Overall Body – ±0.02 mm |
| Flatness/Coplanarity | ≤0.01 mm across seating surface (ensures uniform contact pressure). | Pin/Lead Channel Width & Depth | Width – ±0.003 mm; Depth – ±0.005 mm (adjustable for lead deflection). |
| Pin/Lead Channel Pitch Accuracy | ±0.005 mm (fine-pitch ICs), ±0.01 mm (standard). | Brand Name | Yiding |
| Certification | ISO 9001 | Place of Origin | Guangdong, China |
| High Light | Precision Machined Semiconductor Test Socket ,Semiconductor Test Socket High Performance ,Customization semiconductor socket | ||
Product Overview
The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.
Surface & Finish
Contact Channels: Ra ≤ 0.2 µm (mirror finish)
Non-Contact Surfaces: Ra ≤ 0.8 µm
Burr-Free: Micro-deburred edges, ISO 13715 compliant
Protective Coatings & Plating Options
Hard-coat anodizing (Aluminum)
Electroless Nickel (50–100 µin)
Gold Flash (0.1–0.3 µin) for enhanced conductivity
Cleanliness & Packaging
Class 100 cleanroom packaging
Non-volatile residue <5 µg/cm²
Ion-free option available
Certifications
ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883
Technical Advantages
Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion
Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures
Prevents warping, misalignment, or probe disengagement under thermal cycling
Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials
PTFE fillers or dry-film coatings reduce friction, galling, and particle generation
With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
25years
Total Annual:
1500000-2000000
Employee Number:
50~100
Ecer Certification:
Verified Supplier
Dongguan Yiding Technology Co., Ltd. was established in 1999 and is headquartered in Dongguan City, China. With over two decades of experience, we specialize in providing precision machining and sheet metal fabrication services, offering customized parts and solutions for a wide range of industries.... Dongguan Yiding Technology Co., Ltd. was established in 1999 and is headquartered in Dongguan City, China. With over two decades of experience, we specialize in providing precision machining and sheet metal fabrication services, offering customized parts and solutions for a wide range of industries....
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