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3.12 inch 256x64 Pixel OELD Module Serial Interface High Brightness
This high-performance 3.12-inch OEL display module features 256×64 resolution and 4-Wire SPI serial interface. Equipped with SSD1362 driver IC and Passive Matrix technology, it delivers 80-100 Cd/m² brightness, 10,000:1 high contrast, and free viewing angles. With 16 gray scales (white), wide temperature adaptability (-40℃ to 70℃) and reliable performance, it's ideal for industrial controls, portable instruments, IoT devices, and embedded systems requiring high-resolution display.
Product Specifications
Display Type
3.12 inch OEL (Monochrome White with 16 Gray Scales)
Module Number
GME64256-10
WiseChip Part ID
UG-5664ASWMG01
Resolution
256(H)×64(V) dots
Drive IC
SSD1362
Display Mode
Passive Matrix
Drive Duty
1/64 Duty
Interface
4-Wire SPI Serial Interface
Module Size
98.9(W)×25.8(H)×2.0(T) mm
Panel Size
86.9(W)×25.8(H)×2.0(T) mm
Active Area
76.78(W)×19.18(H) mm
Pixel Pitch
0.3(W)×0.3(H) mm
Pixel Size
0.28(W)×0.28(H) mm
Weight
TBD (g) ± 10%
Brightness
Min. 80 Cd/m², Typ. 100 Cd/m²
Contrast Ratio
>10,000:1 (Dark Room)
Operating Temperature
-40℃ to 70℃
Storage Temperature
-40℃ to 85℃
Service Life
TBD hours (@100 Cd/m², 50% Checkerboard)
Logic Supply Voltage (VDDIO)
2.7V to 3.5V (Typ. 3.0V)
Core Logic Voltage (VDD)
Typ. 2.6V (Generated by internal regulator)
Panel Driving Voltage (VCC)
11.5V to 12.5V (Typ. 12.0V)
Technical Features
4-Wire SPI serial interface for simple wiring and stable data transmission, easy integration with mainstream MCUs
3.12-inch display with 256×64 high resolution and 16 gray scales, delivering clear and detailed visual effects
80-100 Cd/m² high brightness and >10,000:1 contrast ratio, ensuring excellent visibility in various environments
Wide operating temperature range (-40℃ to 70℃) adapts to industrial, outdoor, and extreme environment applications
Low power consumption: Typ. 250μA (VDDIO), 29mA (VCC, 50% display area on), sleep mode current ≤20μA (VDDIO)
SSD1362 driver IC ensures reliable performance, stable signal processing and long-term operation stability
Built-in ESD protection circuit (via N.C.(ESD) pins) to prevent electrostatic damage during handling and use
RoHS compliant, meeting international environmental standards and market access requirements
Pin Definition
PIN
Symbol
Description
1
N.C.(ESD)
Reserved Supporting Pin; Must be connected to external ground for ESD protection
2
VCC
Power Supply for OEL Panel; The most positive voltage supply pin of the chip, must be supplied externally
3
VCOMH
Voltage Output High Level for COM Signal; Input pin for COM signal high level output, connect capacitor to VSS
4
VP
Voltage for SEG Pre-Charge; Segment pre-charge voltage reference pin, capacitor can be connected to VSS for better performance
5
VDD
Power Supply for Logic Operation; 1.65V-2.6V external supply or internal regulated from VDDIO (VDDIO>2.6V); Connect capacitor to VSS
6
VSS
Ground of Logic Circuit; Ground pin, acts as reference for logic pins, must be connected to external ground
7
VDDIO
Power Supply for Core and I/O; Voltage supply pin, must be connected to external source
8
IREF
Current Reference for Brightness Adjustment; External use: connect resistor to VSS (≈18.75μA); Internal use: keep NC
9
CS#
Chip Select; Active LOW to enable MCU communication
10
RES#
Power Reset for Controller and Driver; Pull LOW for initialization, keep HIGH during normal operation
Serial Clock Input Signal; Clock signal for bus communication, data bit transmitted per clock period
13
SDIN
Serial Data Input Signal; Communication channel, data latched at SCLK rising edge (MSB first), converted to 8-bit parallel data
14
N.C.(ESD)
Reserved Supporting Pin; Must be connected to external ground for ESD protection
Application Scenarios
Industrial control systems (PLC panels, sensor data monitors, industrial controllers with high-resolution requirements)
Portable electronic instruments (handheld multimeters, data loggers, portable detectors needing detailed data display)
IoT terminals and smart sensors (environmental monitors, wireless control nodes, high-precision data visualization devices)
Embedded systems and microcontroller projects (compatible with mainstream MCUs via SPI interface)
Consumer electronics (small POS machines, smart home control panels, portable audio-visual devices)
Automotive auxiliary displays (in-vehicle monitoring screens, secondary control panels with clear information display)
Medical portable equipment (small diagnostic devices, health monitors requiring accurate data presentation)
Test and measurement equipment (laboratory instruments, field test tools needing high-resolution display interfaces)
Customization Options
Interface Configuration SPI communication parameter optimization and address setting for specific MCU compatibility
Brightness Tuning Customizable brightness levels (80~100 Cd/m²) based on application environment requirements
Polarizer Selection Anti-glare polarizer options for outdoor or high-brightness environment use
Packaging Solution Custom anti-static vacuum packaging with desiccant for long-distance transportation and storage
Labeling Service Custom part number or brand logo printing on the module for identification
Quality Inspection Enhanced aging tests and performance calibration for bulk orders to ensure stability
Technical Support Customized initialization code, driver libraries, and SPI interface integration guides
Handling Notes
Electrostatic Protection: Use anti-static bracelets and grounded tools during handling. Work in non-dry environments to suppress static generation. Avoid touching pins, electrodes, or FPC patterns directly.
Cleaning Instructions: Clean the substrate surface with Scotch Mending Tape No. 810 or equivalent. Do not use water, ethyl alcohol, ketone, or aromatic solvents as they may damage the substrate.
Soldering Requirements: Follow standard soldering procedures to avoid excessive temperature or time; ensure reliable connection of ESD protection pins to ground.
Storage Conditions: Store in anti-static bags at 23±5℃, humidity ≤55±15%RH. Avoid direct sunlight, high temperature, high humidity, and low temperature (below 0℃) environments. Prevent water drops or dew on packages.
Power Sequence: Power-on: VDD → Display off command → Initialization → Clear Screen → VCC → Delay 100ms → Display on command. Power-off: Display off command → Power down VCC → Delay 100ms → Power down VDD. Never pull VDD or VCC to ground.
Mechanical Protection: Do not apply mechanical impacts (dropping, striking) or excessive pressure to the display surface. Avoid bending the display or FPC tails forcibly. Do not disassemble or modify the module.
Overcurrent Protection: Install 0.5A fuse in the VDD power circuit to prevent damage from excessive current. Keep signal line cables short to avoid noise interference.
Light Shielding: Design product and installation method to shield the exposed OEL driver from light, as light radiation may cause malfunction.
Pin Definition
Custom Order Support (ODM)
Product Process
Shipment & Payment
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Exporter,Seller,Agent,Trading Company
Year Established:
2008
Total Annual:
6000000-8000000
Employee Number:
200~230
Ecer Certification：
Verified Supplier
Shenzhen YZY Technology Company Limited is a professional factory specializing in the research, design, production, and service of LCD display, Touch screen, Raspberry Pi display, and Driver board.
We adhere to the "Customer First" principle, offering high-qua... Shenzhen YZY Technology Company Limited is a professional factory specializing in the research, design, production, and service of LCD display, Touch screen, Raspberry Pi display, and Driver board.
We adhere to the "Customer First" principle, offering high-qua...
