CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | 5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS |
| Keywords | Thermal Pad |
| Thermal conductivity | 5.0W/mK |
| Hardness | 20/65 Shore 00 |
| Application | LED CPU GPU MOS |
| Color | Gray |
| Specific Gravity | 3.4 g/cm³ |
| Flame rating | 94-V0 |
| Sample | Sample free |
| Materials | Ceramic filled silicone elastomer |
| Brand Name | Ziitek |
| Model Number | TIF800US |
| Certification | RoHS |
| Place of Origin | Vietnam |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | 5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS | Keywords | Thermal Pad |
| Thermal conductivity | 5.0W/mK | Hardness | 20/65 Shore 00 |
| Application | LED CPU GPU MOS | Color | Gray |
| Specific Gravity | 3.4 g/cm³ | Flame rating | 94-V0 |
| Sample | Sample free | Materials | Ceramic filled silicone elastomer |
| Brand Name | Ziitek | Model Number | TIF800US |
| Certification | RoHS | Place of Origin | Vietnam |
TIF®800US 5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS
Product descriptions
The TIF®800US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 5.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF®800USSeries | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
Products specification
Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.For other
thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem... CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem...
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