TIF100N 8085-06 White Color Low Dielectric Thermally Conductive Gap Filler Pads

Product Specification

White Color Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

 Product descriptions

TIF^®100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long- term durability requirements. In addition,the material itself has low dielectric properties,which can effectively reduce energy loss during high-frequency signal transmission and ensure signal integrity.

Features

•  Low dielectric constant effectively reduces signal loss
•  Excellent thermal conductivity
•  Excellent weather resistance and aging resistance
•  Excellent long-term reliability

Applications

•  Millimeter wave radar
•  Semiconductor Microwave Components
•  5G base station
•  RF power amplifier
•  High performance computing / server memory

Product Specifications

Standard Thickness: 0.012" (0.30 mm)~0.120"
Standard Size:4.7"X4.7" (120 mmX120 mm)

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

FAQ:

Q:What is a Thermal Interface Material (TIM)?
A:TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.

Q:What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q:What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Q:What is the difference between Thermal Conductivity and Thermal Resistance?
A: Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.

Q:Does higher thermal conductivity always mean better cooling performance?
A: Not necessarily. Actual cooling performance is also affected by material thickness, interface contact, compression properties, contact area, heat source power, and heat sink design. Therefore, when selecting a TIM, both thermal conductivity and actual thermal resistance should be evaluated.