TIF100 6050-19 Good Softness And Fillability Thermally Conductive Gap Filler

Product Specification

Good Softness And Fillability Thermally Conductive Gap Filler Pads For EV Battery And Energy Storage

Product descriptions

TlF^®100 6050-19 Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for awide range of electronic components.It is an ideal choice for addressing medium to high power heat dissipation needs,achieving the best balance between cost and performance.

Features

>High thermal conductivity
>Good softness and fillability
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance

Application

>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems

Product Specifications

Standard Thickness: 0.040" (1.00 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16"(406 mmX406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options:A1/A2(Single-sided/Double-sided adhesive).

The TIF^®️ series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek, founded in 2006, is a high-tech enterprise with independent research and development as its core driving force, focusing on the development and manufacture of heat conduction, heating, sealing and EMI products. The company gathered senior engineers to form a research and development team. In the wave of continuous innovation in the manufacturing industry, it constantly broke through the material technology boundary, and successively developed many core products such as TIF thermal pad, TIG thermal paste, TIC phase change material, TIF900 series EMI material, K-heat heating product and Z-foam seal. Headquartered in Dongguan, with production bases in Kunshan, Taiwan Province and Viet Nam, the company empowers new energy, AI, 5G, aerospace and other fields with technological innovation to provide leading thermal management solutions for global customers.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

FAQ:

Q:What Is a Thermal Interface Material (TIM)?
A:Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

Q:What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?

A:Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

Q:What Is Thermal Resistance in Thermal Interface Materials?

A:Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.

Q:What Is the Difference Between Thermal Conductivity and Thermal Resistance?

A:Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.

Q:Does Higher Thermal Conductivity Always Mean Better Cooling?

A:Not necessarily. Thickness, interface contact, compression and actual thermal resistance can signi

ficantly affect final cooling performance.