CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics |
| Keywords | Silicone Thermal Pad |
| Materials | Ceramic filled silicone elastomer |
| Hardness | 65/45 Shore 00 |
| Color | Dark Gray |
| Flame rating | 94-V0 |
| Sample | Sample free |
| Thermal conductivity | 5.0W/mK |
| Application | Automotive Electronics Cooling |
| Density | 3.15g/cm³ |
| Brand Name | Ziitek |
| Model Number | TIF100-50-11S |
| Certification | RoHS |
| Place of Origin | Vietnam |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics | Keywords | Silicone Thermal Pad |
| Materials | Ceramic filled silicone elastomer | Hardness | 65/45 Shore 00 |
| Color | Dark Gray | Flame rating | 94-V0 |
| Sample | Sample free | Thermal conductivity | 5.0W/mK |
| Application | Automotive Electronics Cooling | Density | 3.15g/cm³ |
| Brand Name | Ziitek | Model Number | TIF100-50-11S |
| Certification | RoHS | Place of Origin | Vietnam |
CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics
Product descriptions
The TIF®100-50-11S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Application
> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Micro heat pipe thermal solutions
> Telecommunication hardware
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIF®100-50-11S Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.15 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem... CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem...
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