CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
| Payment Terms | T/T |
| Supply Ability | 1000 KG |
| Delivery Time | 3-5 work days |
| Packaging Details | 1kg/can |
| Products name | One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue |
| Chemical Type | Epoxy |
| Thermal Conductivity | 2.5W/mK |
| Hardness | 92 Shore A |
| Keywords | Thermal Conductive Epoxy Glue |
| Appearance uncured | Gray Paste |
| Components | One Component /part |
| Brand Name | Ziitek |
| Model Number | TIE380-25 |
| Certification | UL and RoHs |
| Place of Origin | Vietnam |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000 KG |
| Delivery Time | 3-5 work days | Packaging Details | 1kg/can |
| Products name | One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue | Chemical Type | Epoxy |
| Thermal Conductivity | 2.5W/mK | Hardness | 92 Shore A |
| Keywords | Thermal Conductive Epoxy Glue | Appearance uncured | Gray Paste |
| Components | One Component /part | Brand Name | Ziitek |
| Model Number | TIE380-25 | Certification | UL and RoHs |
| Place of Origin | Vietnam |
TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue
Product Summary:
TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength.
TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.
Feature
> Good thermal conductivity: 2.5W/mK
> Good maneuverability andadhesion performance
> Low shrinkage
> Low viscosity, easy-to-gas emissions
> Good solvent resistance, water resistance
> Longer working hours
> Excellent resistance to thermal shock
| Typical Properties of TIETM380-25 | ||
| Chemical type | Epoxy | Test Method |
| Appearance uncured | Gray Paste | Visual |
| Appearance cured | Dull Gray Solid | Visual |
| Components | One Component | ***** |
| Heat Capacity | 0.7 l/g-K | ASTM C351 |
| Key Substrates | Metals, ceramics | ***** |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temp | -40 to 180℃ | ***** |
| Tensile strength Al/Al @25°C | >2800psi | ***** |
| Thermal Conductivity | 2.5W/m-K | ASTM D5470 |
Application Features:TIE™380-25
Color: Gray
Viscosity@25℃ : 140,000 cPs
Specific Gravity@25℃: 2.1 g/cc
Shelf life @25℃° : 10 Days
@0℃° : 6 Months
(Storage methods and temperature will affect the shelf life)
Curing procedures:
Curing temperature Curing time
100℃°: 3 Hours
125℃ : 1.5 Hour
150℃: 20 Minutes
170℃: 5 Minutes
General package:
1kg/can
Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s... Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s...
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