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CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

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China TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat
China TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat

  1. China TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat
  2. China TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat

TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat

  1. MOQ: 1000pcs
  2. Price: 0.1-10 USD/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 100000pcs/day
Delivery Time 3-5 work days
Packaging Details 24*13*12cm cartons
Products name Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad
Color Gray
Thermal conductivity 1.5W/mK
Specific Gravity 2.1g/cm³
Application CPU & Electronic Component Gap Filling
Keywords Thermal Pad
Materials Ceramic filled silicone elastomer
Flame rating 94-V0
Hardness 65/45 Shore 00
Brand Name Ziitek
Model Number TIF100-10S
Certification RoHS
Place of Origin Vietnam

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 100000pcs/day
Delivery Time 3-5 work days Packaging Details 24*13*12cm cartons
Products name Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad Color Gray
Thermal conductivity 1.5W/mK Specific Gravity 2.1g/cm³
Application CPU & Electronic Component Gap Filling Keywords Thermal Pad
Materials Ceramic filled silicone elastomer Flame rating 94-V0
Hardness 65/45 Shore 00 Brand Name Ziitek
Model Number TIF100-10S Certification RoHS
Place of Origin Vietnam

TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad

 

Product descriptions

 

TlF®100-10S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

 

> Good thermal conductive 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts

 

Application

 

> Mainboard/mother board
> Notebook
> Power supply
> Micro heat pipe thermal solutions
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

 

Typical Properties of TIF®100-10S Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1MHz 4.5 MHz ASTM D150
Volume Resistivity(Ohm-cm) >1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
1.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2006

  • Total Annual:

    1000000-16000000

  • Employee Number:

    200~500

  • Ecer Certification:

    Verified Supplier

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem... CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem...

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  • Reach Us
  • CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
  • Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
  • https://www.ziitek.com.vn/

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