CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts nam | High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board |
| Materials | Ceramic filled silicone elastomer |
| Thickness range | 0.010inch (0.25mmT)~0.200inch (5.0mm) |
| Hardness | 65/35 Shore 00 |
| Color | Green |
| Thermal conductivity | 1.8W/mK |
| Specific Gravity | 2.3g/cm³ |
| Flame rating | 94-V0 |
| Application | CPU & Electronic Component Gap Filling |
| Keywords | Heat Transfer Pads |
| Brand Name | Ziitek |
| Model Number | TIF100-18-56E |
| Certification | RoHS |
| Place of Origin | Vietnam |
View Detail Information
Explore similar products
TIF100-07S Silicone Thermal Pad Gpu SSD Thermal Pad
TIF100 6045-62 High Strength 6.0W Electrically Insulating Pad Thermal Pad For
TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal
TIF200-15-12S Customized Self Adhesive Thermal Gap Filler Pad
Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts nam | High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board | Materials | Ceramic filled silicone elastomer |
| Thickness range | 0.010inch (0.25mmT)~0.200inch (5.0mm) | Hardness | 65/35 Shore 00 |
| Color | Green | Thermal conductivity | 1.8W/mK |
| Specific Gravity | 2.3g/cm³ | Flame rating | 94-V0 |
| Application | CPU & Electronic Component Gap Filling | Keywords | Heat Transfer Pads |
| Brand Name | Ziitek | Model Number | TIF100-18-56E |
| Certification | RoHS | Place of Origin | Vietnam |
High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board
Product descriptions
TlF®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Features
> Good thermal conductive 1.8W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
Application
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF®100-18-56E Series | |||
| Property | Value | Test method | |
| Color | Green | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | |
| 1.8 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem... CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem...
Get in touch with us
Leave a Message, we will call you back quickly!