CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU |
| Materials | Ceramic filled silicone elastomer |
| Thermal conductivity | 2.0W/mK |
| Color | Dark Gray |
| Hardness | 27 (Shore 00) |
| Specific Gravity | 2.5 g/cc |
| Keywords | Thermal pad |
| Application | AI Processors AI Servers CPU |
| Brand Name | Ziitek |
| Model Number | TIF100-20-11U |
| Certification | RoHS |
| Place of Origin | Vietnam |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU | Materials | Ceramic filled silicone elastomer |
| Thermal conductivity | 2.0W/mK | Color | Dark Gray |
| Hardness | 27 (Shore 00) | Specific Gravity | 2.5 g/cc |
| Keywords | Thermal pad | Application | AI Processors AI Servers CPU |
| Brand Name | Ziitek | Model Number | TIF100-20-11U |
| Certification | RoHS | Place of Origin | Vietnam |
TIF®100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU
Product descriptions
TlF®100-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
>Good thermal conductivity: 2.0 W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness
Application
> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED Tv/ Lighting
> Graphics Card Thermal Module
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®100-20-11U Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.5 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 2.0 W/m-K | ASTM D5470 | |
| 2.0 W/m-K | ISO22007 | ||
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem... CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal managem...
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