JINXING MATECH CO LTD
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Delivery Time | 25 work days |
| Packaging Details | Plywood Case |
| Supply Ability | 1000kgs/M |
| Material | Molybdenum Copper Alloy |
| Standard | ASTM, AMS |
| Surface | Mirror bright |
| Size | Customized |
| Min THK | 0.05mm |
| Type | MoCu15~MoCu50 |
| Brand Name | JINXING |
| Model Number | Molybdenum Copper Wafer substrate |
| Certification | ISO 9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T, Western Union | Delivery Time | 25 work days |
| Packaging Details | Plywood Case | Supply Ability | 1000kgs/M |
| Material | Molybdenum Copper Alloy | Standard | ASTM, AMS |
| Surface | Mirror bright | Size | Customized |
| Min THK | 0.05mm | Type | MoCu15~MoCu50 |
| Brand Name | JINXING | Model Number | Molybdenum Copper Wafer substrate |
| Certification | ISO 9001 | Place of Origin | China |
| High Light | Molybdenum Wafer Substrate ，Copper Molybdenum Products Wafer Substrate ，High Thermal Conductivity Molybdenum Wafer Substrate | ||
Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.
Description
Nickel-plated gold-plated molybdenum-copper substrate microelectronic electronic sealing sheet
Copper-molybdenum-copper alloy heat sink material is a composite material of tungsten and copper. It has both low expansion characteristics of tungsten and high thermal conductivity of copper. Especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material. The composition of the composition (in terms of terms, its performance is tailorable), thus bringing great convenience to the application of the material. The copper-molybdenum-copper alloy heat sink material produced by our company can form a good thermal expansion match with the following materials:
| Ceramic materials | Al2O3 (A-90, A-95, A-99), BeO (B-95, B-99), AlN, etc. |
| Semiconductor materials | Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP, and AlGaAs |
| Metal materials | Kovar alloy (4J29), 42 alloy, etc |
The characteristics and performance of our company's copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material:
Copper-molybdenum-copper (Cu/Mo/Cu) is a sandwich structure consisting of two sub-layers - copper (Cu) - a core layer - molybdenum (Mo), which has an adjustable coefficient of thermal expansion, high thermal conductivity and its high The characteristics of strength.
1. Copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material Features:
High thermal conductivity can be maintained without adding sintering and activation elements such as Fe and Co
Can provide semi-finished products or finished products with Ni/Au plating on the surface
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Importer,Exporter,Seller,Other
Year Established:
2007
Total Annual:
5,000,000-10,000,000
Employee Number:
10~25
Ecer Certification：
Site Member
JINXING MATECH is a research and development, production, processing and sales of integrated, comprehensive refractory metal, precious metal material manufacturer.JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten , Tungsten copper , Titanium ... JINXING MATECH is a research and development, production, processing and sales of integrated, comprehensive refractory metal, precious metal material manufacturer.JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten , Tungsten copper , Titanium ...
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