Pure Nickel Sputtering Target 4N 99.99%

Product Specification

Overview

Pure Nickel Sputtering Target is a sputtering target made of high-purity nickel with a purity of 99.99%, which is mainly used in physical deposition technology to create high uniformity and high-performance films. With its excellent conductivity, corrosion resistance, and high-temperature stability, it plays an irreplaceable role in fields such as aerospace, integrated circuit manufacturing, display devices, and new energy batteries. Our company has more than ten years of professional experience in the production and export of sputtering targets, and can also provide customers with customized titanium targets, tungsten targets, chromium targets, and other products. If you are interested, please feel free to contact us by email.

4N Nickel Advantages

• High purity avoids impurities forming defects in the film or affecting electron migration characteristics, and can achieve uniform film formation of large areas of substrates.
• Good chemical stability, dense film without defects, acid and alkali resistance, and oxidation, can adapt to various harsh working conditions.
• Good conductivity and low resistivity can significantly reduce the power consumption of electronic devices in integrated circuits.
• Stable performance at high temperatures, suitable for high-power sputtering and subsequent high-temperature processes.
• It has excellent ductility and can achieve near-total densification through the hot isostatic pressing process, reducing the risk of target deformation during sputtering and having a long service life.

Pure Nickel Sputtering Target Dimension

Nickel Sputtering Target Application

1. Semiconductors and Integrated Circuits: Pure Nickel Sputtering Target manufactures large-scale integrated circuits as gate contact layer materials, ensuring chip conductivity and longevity. Of course, it can also be used as a barrier layer between the gold conductive layer and the nickel bonding layer to ensure the reliability of the metal interconnection.
2. Electronic functional devices: used for the preparation of magnetic memory devices, magnetic sensors, magnetic random memory, and other magnetic devices; It is used in electronic devices to reduce electromagnetic interference and improve equipment performance and reliability.
3. Aerospace: Used to create protective films for components, heat exchangers, and engine components in high-temperature environments, ensuring the safety of aircraft operations.
4. Tool coating: The surface coating used to prepare tools effectively reduces the wear of the tool matrix material during production and processing, significantly improving the service life of the tool.
5. Solar cells: Used to prepare electrodes, absorbing layers, barrier layers, and other structures to improve the conversion efficiency and stability of cells.
6. Decoration Field: Used in high-end electrical enclosures, electronic product panels, and other fields, providing a bright silver metallic luster.

Nickel Target Process

(1) Electron beam melting: Use high-energy electron beams to bombard nickel raw materials in a high vacuum environment to melt them to achieve deep purification

(2) Vacuum induction melting: further removes gaseous impurities (such as oxygen, nitrogen) and controls the uniformity of the composition.

(3) Casting molding: The purified high-purity nickel liquid metal is cast into solid ingots using molds.

(4) Plastic processing: high-temperature forging, hot rolling, cold rolling, and warm rolling of nickel ingots to greatly refine the grains and make them uniform and dense in size.

(5) Heat treatment: intermediate annealing and recrystallization annealing to ensure that the target has a stable microstructure.

(6) Precision machining: Cutting, milling, drilling, and other machining according to customer requirements to achieve precise dimensional tolerances.

(7) Surface treatment: After electrolytic polishing or mechanical polishing, the surface roughness is Ra≤0.2 μm to ensure that the surface is flat and there are no obvious defects.

Pure Nickel Sputtering Target Pictures

Packing