Shenzhen APG Material Company Limited
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport |
| Delivery Time | 4-5 weeks |
| Payment Terms | T/T |
| Supply Ability | Stable supply |
| Name | Inductor Core Paste |
| Solid Content (wt%) | 70~75 |
| Viscosity (Pa·S) | 60±20 |
| Fineness (90%) | ≤7.5μm |
| Core Functions | Forms the magnetic circuit, Provides magnetic permeability |
| Key Features | High Magnetic Permeability, Low Magnetic Loss, Excellent Flowability and Fillability, Good Thermal Stability |
| Application Field | Mainly used in the manufacturing of integrated voltage regulator modules (FIVR) planar inductors,andembedded inductor magnetic sheets, serving high-end power electronics fields such as servers,data centers,and newenergy vehicle onboard power supplies. |
| Brand Name | APG |
| Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
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Product Specification
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport | Delivery Time | 4-5 weeks |
| Payment Terms | T/T | Supply Ability | Stable supply |
| Name | Inductor Core Paste | Solid Content (wt%) | 70~75 |
| Viscosity (Pa·S) | 60±20 | Fineness (90%) | ≤7.5μm |
| Core Functions | Forms the magnetic circuit, Provides magnetic permeability | Key Features | High Magnetic Permeability, Low Magnetic Loss, Excellent Flowability and Fillability, Good Thermal Stability |
| Application Field | Mainly used in the manufacturing of integrated voltage regulator modules (FIVR) planar inductors,andembedded inductor magnetic sheets, serving high-end power electronics fields such as servers,data centers,and newenergy vehicle onboard power supplies. | Brand Name | APG |
| Place of Origin | china | Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
| High Light | Filling Inductor Core Paste ，High Magnetic Permeability Inductor Core Paste | ||
Inductor core paste is a high-performance functional medium formulated from soft magnetic alloys (such as Fe-based amorphous powders), specialized epoxy resins, and active diluents. Engineered for filling or precision printing, the material achieves high magnetic permeability and minimal core loss upon curing. Its robust magnetic profile is specifically optimized for high-frequency and elevated-temperature operational environments.
● High Heat Resistance
Glass transition temperature >150°C, with some products capable of withstanding temperatures up to 200°C, ensuring stability in high-temperature environments.
● High Fillability and Flowability
Optimized alloy powder grading with multiple particle sizes, achieving high solid content filling, avoiding cracking or void formation during curing.
● Process-Friendly
Viscosity is adjustable, suitable for filling PCB vias or embedded forming on substrates, simplifying the integration process.
This material is primarily utilized in the fabrication of Fully Integrated Voltage Regulators (FIVR), planar inductors, and embedded magnetic substrates. It serves as a critical technology enabler for high-performance power electronics in AI servers, hyperscale data centers, and Next-Generation Vehicle (NGV) power modules.
Company Details
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Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ... Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people. APG specializes in the research and development (R&D) and production of PVD materials (sputtering targ...
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