Chongqing Zhongshun Microelectronics Co., Ltd
| Camera Size | Supports rapid sample customization |
| Sensor Brand | ST |
| Sensor Type | VD55H1CCA0 |
| Pixel Size | 4.6 μm*4.6 μm |
| Data Interface | MIPI 4 Lane |
| Power | 2.8V/1.8V/1.1V |
| Focus mode | FF |
| Active Array Size | 672*804 |
| Shutter | GS |
| IR Filter | Clear/650nm/850nm/940nm（Optional or customized） |
| Optical format | 1/4'' |
| Max Frame rates | 60fps |
| FOV | DFOV:20°-180°（Optional or customized） |
| Color | MONO |
| Model Number | VD55H1 |
| Brand Name | Chippack |
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Product Specification
| Camera Size | Supports rapid sample customization | Sensor Brand | ST |
| Sensor Type | VD55H1CCA0 | Pixel Size | 4.6 μm*4.6 μm |
| Data Interface | MIPI 4 Lane | Power | 2.8V/1.8V/1.1V |
| Focus mode | FF | Active Array Size | 672*804 |
| Shutter | GS | IR Filter | Clear/650nm/850nm/940nm（Optional or customized） |
| Optical format | 1/4'' | Max Frame rates | 60fps |
| FOV | DFOV:20°-180°（Optional or customized） | Color | MONO |
| Model Number | VD55H1 | Brand Name | Chippack |
| High Light | 0.54 MP MONO Global Shutter camera module ，MIPI camera module with VD55H1 sensor ，68 Perspective Global Shutter camera module | ||
0.54 MP MONO Global Shutter 68 Perspective MIPI Camera Module With VD55H1 Sensor
1. Basic Parameters:
‑ Resolution: 672(H)×804(V), 0.54MP. It enables high‑density 3D depth point acquisition with rich imaging details and high‑fidelity spatial reconstruction.
‑ Pixel Size: 4.6μm(H)×4.6μm. Adopting CDTI charge‑domain pixel architecture combined with back‑illuminated design, it balances photosensitivity and imaging stability and effectively reduces imaging noise.
‑ Optical Format: 1/4‑inch. Compact in size, it is suitable for integration design of various miniature modules.
‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.
‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range allows adaptation to diverse working environments.
2. Technical Features:
‑ Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption for illumination.
‑ It adopts 65‑nm stacked Back‑Side Illuminated (BSI) wafer process and is equipped with a dedicated 940 nm infrared photosensitive system. Its demodulation contrast reaches over 85%, delivering excellent resistance to ambient light interference. It can output high‑definition and clean depth images under complex low‑light and high‑light conditions.
‑ Supporting high‑frequency modulation at 200 MHz, it achieves greatly reduced depth noise compared with conventional hundred‑megahertz ToF sensors. Typical ranging distance reaches 5 m under full‑resolution mode, and the ranging distance can be further extended under patterned illumination conditions, featuring high ranging accuracy and wide detection range.
‑ VD55H1 MONO Camera Module: Compatible with standard modules with different lens configurations such as 68° to meet diverse customer requirements.
3. Application Fields:
It is applied in virtual reality / augmented reality, biometric recognition, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.
4. Customization Services:
Custom modules can be produced according to customer requirements to deliver tailor‑made products matching customers’ needs.
Company Details
Business Type:
Manufacturer
Year Established:
2018 Year
Employee Number:
200~300
Ecer Certification：
Verified Supplier
Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a... Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a...
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