Chongqing Zhongshun Microelectronics Co., Ltd

I. Business Overview

Based in Dazu High-Tech Zone, Chongqing Zhongshun Microelectronics boasts a full-fledged R&D team and fully automated production lines. The company specializes in image sensors, industrial camera modules, MEMS chips and semiconductor packaging. It offers two core cooperation models—professional OEM consignment manufacturing and customized ODM solutions—for clients in industrial equipment, medical electronics, security surveillance and smart hardware sectors, delivering one-stop services covering R&D design, sample prototyping, mass production, testing and packaging.

II. OEM Consignment Manufacturing Model

OEM stands for Original Equipment Manufacturing, under which clients provide complete product solutions. Clients independently supply full sets of documents and materials including product drawings, PCBs, chips, electronic components, appearance structures and brand logos. Our company completes all processing procedures with in-house production lines for SMT, COB bonding, IC packaging and module assembly.

Our service scope covers PCB mounting, chip packaging, module assembly, aging testing and finished product packaging. We are solely responsible for manufacturing throughout the whole process, and finished goods are printed with the client’s LOGO and brand information before delivery.

This model suits brand clients with mature product solutions but no proprietary factories who only outsource mass production. We flexibly accept orders of all batch sizes and manufacture products in strict accordance with clients’ process standards. All materials and intellectual property rights belong to clients, with full confidentiality of product solutions guaranteed.

III. Customized ODM Solution Model

ODM refers to Original Design Manufacturing. Leveraging our in-house R&D capabilities, we have mature standardized complete sets of solutions for sensors, camera modules and IC packaging. Clients do not need to develop products from scratch; they may directly select existing mature products, or put forward customized requirements for functions, dimensions and performance. Our R&D team will adjust circuits, structures and optical parameters accordingly to complete revised prototyping.

All production processes are carried out on our proprietary production lines. Clients only need to modify appearance, color schemes, software parameters and packaging before selling products under their own brands.

This model drastically cuts clients’ upfront R&D investment and shortens the time-to-market of new products. Small-batch trial production and iterative upgrades are supported, catering to startup brands, distributors and complete equipment manufacturers for rapid new product launches.

IV. Universal Supporting Advantages of the Two Models

1. Production Assurance: Class 10,000 dust-free clean workshops, 24-hour mass production via fully automatic production lines, full-process MES traceability, and stable factory yield rates.

2. Quality Control: Compliance with the ISO9001 management system, three-layer quality inspection including IQC, IPQC and FQC, and comprehensive reliability tests covering high-low temperature cycling, vibration resistance and optical performance.

3. Flexible Delivery: Support small-batch R&D prototyping orders and long-term large-batch orders with controllable delivery schedules.

4. Confidentiality Mechanism: Non-disclosure agreements signed with all clients; strict control over the leakage of drawings, samples and finished products to safeguard clients’ intellectual property rights.

I. Overview of the Enterprise Production Lines

Chongqing Zhongshun Microelectronics is located in Dazu High-Tech Zone, a high-tech enterprise integrating R&D, semiconductor packaging, sensor module manufacturing, and customized OEM/ODM production. The factory is equipped with Class 10,000 constant-temperature and constant-humidity dust-free clean workshops, and fully automated intelligent manufacturing production lines covering the entire processes of SMT mounting, COB chip bonding, IC packaging, camera module assembly and aging testing. It specializes in mass production of image sensors, MEMS chips and industrial camera modules, supports sample prototyping and mass order delivery, implements 2-shift 24-hour automated production, and is backed by a complete quality inspection system to ensure stable delivery.

II. Core Segmented Production Lines

1. SMT Mounting Production Line: Equipped with full sets of high-speed mounters, SPI, AOI and X-Ray inspection equipment, capable of processing micro-components and precision BGA chips with a mounting accuracy of ±0.02mm. It realizes closed-loop automation of printing, mounting, soldering and defect inspection, and supports OEM consigned mounting and ODM matching motherboard processing.

2. COB Chip Bonding Production Line: A dedicated dust-free packaging line that performs wafer die bonding, gold wire bonding and plastic packaging curing for processing CMOS image sensors and miniature bare sensor dies, serving as the core manufacturing process for self-developed ODM modules.

3. IC Packaging Production Line: Capable of packaging various chips including DFN, QFN and BGA, covering grinding, dicing, plastic packaging and electrical testing, and undertakes external OEM chip packaging and foundry services.

4. Camera Module Assembly Production Line: Compatible with industrial AHD, Raspberry Pi high-definition camera modules and more. It automatically completes focusing, FPC pressing, waterproof dispensing and power-on aging, with finished products sorted and packaged uniformly.

5. Reliability Testing Production Line: Fitted with high-low temperature, vibration and optical testing equipment. All products undergo mandatory power-on aging, with precision and durability verified in all dimensions, maintaining a stable factory yield rate of over 99.5%.

III. Workshop Supporting Facilities and Control Standards

The workshop complies with Class 10,000 dust-free standards, with a constant temperature of 22±2℃ and humidity ranging from 40% to 60%, and full-area anti-static protection. It adopts the MES production traceability system to enable full-process tracking via product barcodes. Equipment is calibrated and maintained on a regular basis in compliance with ISO9001 and IPC industrial process standards. A three-level quality inspection system is implemented, consisting of IQC incoming material inspection, IPQC in-process patrol inspection and FQC final inspection. Automatic early warnings are triggered for process abnormalities, and production records are retained for more than 12 months.

IV. Applicable OEM/ODM Services

- OEM Model: Customers provide drawings, materials and design schemes, while our factory undertakes one-stop full-line processing, and finished products are shipped under the customer’s brand.

- ODM Model: Leveraging mature self-developed sensor and camera R&D solutions, our in-house production lines complete full-process manufacturing. Customers only need to fine-tune parameters and appearances before selling under their own brands, greatly shortening the new product development cycle.

I. Overview of the R&D Center

Chongqing Zhongshun Microelectronics has set up an independent R&D center equipped with professional R&D laboratories and sample pilot workshops. Relying on its in-house technical team, the center conducts in-depth research and development on image sensors, industrial camera modules, MEMS sensor chips and semiconductor packaging processes. In coordination with automated production lines, it forms a complete closed loop of "R&D design – sample verification – mass production". It provides core technical support for the company’s ODM customization and customer technical transformation, and delivers technical services such as process optimization and troubleshooting for OEM projects simultaneously.

II. Core R&D Team and Hardware Facilities

The R&D team consists of engineers specializing in multiple fields including hardware circuits, optical imaging, structural design, chip packaging, software debugging and process engineering, with responsibilities covering the full-chain product development. The laboratories are furnished with optical testers, high-low temperature test chambers, signal analyzers, precision prototyping equipment and simulation design software, enabling independent completion of circuit simulation, structural modeling, optical calibration and pre-reliability testing. A supporting small-scale pilot production line can rapidly produce prototypes, test samples and small-batch trial products to shorten the verification cycle for new products.

III. Core R&D Tasks

1. New Product Solution Development: Independently develop standardized solutions such as Raspberry Pi camera modules, medical miniature sensors and MEMS pressure/light-sensing chips to support the supply of standardized ODM products.

2. Customized Technical Development: Adjust hardware parameters, lens specifications, PCB layouts and packaging forms in accordance with customer requirements to develop exclusive customized products.

3. Process Technology Iteration: Continuously optimize production processes including SMT mounting, COB gold wire bonding, chip packaging and module assembly to improve production line yield and product stability.

4. Reliability and Performance Optimization: Conduct high-low temperature, vibration and long-term power-on aging tests to resolve technical pain points such as image noise, sensing accuracy and electrostatic protection.

5. Technical Support Services: Provide supporting technical assistance for OEM customers, including process rectification, defect analysis and drawing optimization.

IV. Synergy Advantages of the R&D Center with OEM/ODM Businesses and Production Lines

- Compatibility with ODM Business: Mature self-developed solutions can be quickly revised on demand without external third-party design, cutting customers’ R&D costs and shortening the time-to-market of new products.

- Compatibility with OEM Business: Before customers’ proprietary solutions go into production, the R&D team conducts advance drawing reviews, predicts production risks and optimizes processing procedures to guarantee mass production yield.

V. R&D Control and Technical Assurance

R&D documents, drawings and samples are managed under classified confidentiality, and non-disclosure agreements can be signed with customers. All new products undergo multiple rounds of sampling and reliability testing before mass production. The company continuously accumulates patents and process technologies. Supported by a mature R&D system, it delivers one-stop R&D and manufacturing services for industries including industrial vision, medical electronics, intelligent security and consumer hardware.

Chongqing Zhongshun Microelectronics Co., Ltd. is a high-tech enterprise deeply engaged in the microelectronics packaging sector. The company has established a system of five core functional departments featuring specialization, refinement and high efficiency, namely the R&D Department, Quality Department, Production Department, Material Department and Marketing Department. Its core team consists of senior technical and management professionals with over ten years of working experience in the semiconductor industry, who deliver solid talent support and core competitiveness for the enterprise’s technological iteration, quality control, efficient production and market expansion.

I. R&D Department – Core of Corporate Innovation and Engine of Technological Iteration

The R&D team boasts more than a decade of experience in semiconductor IC packaging as well as sensor R&D and design. It focuses on core fields including photoelectric sensors, temperature and humidity sensors, wireless modules and chip packaging processes. Equipped with theoretical research, technical development capabilities and mature mass production implementation experience, the team can accurately align cutting-edge industrial technology trends with customers’ personalized requirements.

II. Quality Department – Rigorous Quality Control System to Consolidate Quality Foundations

The Quality Department team oversees product quality control, standardization implementation and brand reputation building of the company. Adhering to the management philosophy of "pursuing perfection, full-process controllability and zero-defect quality", it has built a full-process and all-dimensional quality control system covering raw material incoming inspection, production processes, finished product delivery and after-sales traceability, which fully guarantees the high quality and high stability of the company’s full range of semiconductor packaging and sensor products.

III. Production Department – Efficient Lean Production to Ensure Stable Delivery

As the core executor responsible for mass production realization, capacity output and delivery guarantee, the Production Department team leverages standardized production workshops, industry-leading automated production equipment and mature packaging manufacturing processes to undertake large-scale production, process implementation, capacity coordination and delivery control of all product lines including semiconductor ICs, photoelectric sensors and temperature & humidity sensors. It serves as the critical hub linking technical R&D and market delivery.

IV. Material Department – Integrated Supply Chain Management to Support Efficient Operation

The Material Department undertakes core responsibilities in overall supply chain coordination, material management and material guarantee. Its main work covers raw material procurement, supplier management, material warehouse control, material scheduling, inventory optimization and supply chain resource integration. It provides comprehensive material support for R&D trial production, mass manufacturing and order delivery, acting as the logistical backbone for the enterprise’s smooth operation.

V. Marketing Department – In-depth Market Layout to Empower All-round Development

The Marketing Department is tasked with market expansion, brand development, customer service and channel construction. Relying on the company’s mature product portfolio and technical strengths, it delves into segmented markets such as semiconductor packaging, intelligent sensing and IoT supporting components. Its full-spectrum work includes market research, channel development, customer liaison, order negotiation, after-sales operation and maintenance, and brand promotion.

Development History of Chongqing Zhongshun Microelectronics Co., Ltd.

I. Preparation and Foundation Laying Stage (2013-2018): Technical Pre-research and Factory Construction

The team launched pre-research on packaging processes for semiconductor ICs and MEMS sensors in 2013, accumulating in-depth expertise in image sensors and miniature plastic packaging devices. Shenzhen Zhongshun Optoelectronics was founded in 2016 to conduct differentiated module R&D and manufacturing. In 2018, Chongqing Zhongshun Microelectronics Co., Ltd. was officially registered and settled in Dazu High-tech Zone. The company built core teams for R&D and production lines, defined chip packaging and optoelectronic/temperature-humidity sensor modules as its core businesses, and completed factory production line planning as well as initial equipment procurement.

II. Mass Production and Expansion Stage (2019-2022): Capacity Ramp-up and Market Expansion

The enterprise was certified as a National High-tech Enterprise in 2020 and launched formal large-scale mass production. Its monthly output capacity surged from several thousand K to hundreds of thousands K, accompanied by a corresponding expansion of staff. The company perfected multiple packaging product lines including PLCC, BGA, LGA, DFN, QFN and MEMS.Set up a branch in Shenzhen, establish offices in Xiamen and Taiwan, and expand domestic and overseas customer channels. Meanwhile, it developed supporting sensor businesses and expanded into both industrial and consumer electronics sectors. The company increased its paid-in registered capital and optimized its equity structure.

III. Qualification and Technology Upgrade Stage (2023-2024): Scientific Research & Technology and Patent Accumulation

Standardized R&D laboratories and a full-performance reliability testing platform were established, and key cooperation was reached with the Chinese Academy of Sciences. The team continuously tackled core technologies including miniature module interconnection and image sensor packaging, acquiring more than ten patents and software copyrights in total, and independently developing MEMS energy consumption processing systems and supporting sensor temperature measurement systems. A comprehensive self-developed testing system was built to strengthen integrated chip packaging R&D capabilities, making the company a key semiconductor manufacturer in Dazu High-tech Zone.

IV. Brand Improvement and Steady Development Stage (2025-Present): Specialized, Refined, Unique & Innovative Development and Diversified In-depth Cultivation

The enterprise has been awarded titles including Provincial Specialized, Refined, Unique and Innovative Small & Medium-sized Enterprise, National Technology-based Small & Medium-sized Enterprise, and Grade A Tax Credit Enterprise. It keeps expanding automated packaging production lines and developing new packaging products for vehicle-mounted and medical dedicated sensors. The nationwide production, sales and service network has been improved, covering chip foundry services, customized module development and technical solution provision. The company also expands its talent pool for R&D, deeply engages in the domestic substitution track of microelectronic packaging, and continuously expands its influence in the regional semiconductor industry.

1. Custom Design of Chip Solutions

Drawing on profound accumulated semiconductor R&D technologies, we specialize in customized design services for personalized solutions of various chip products, including IC chips, MEMS micro-electromechanical chips, optoelectronic sensors, temperature and humidity sensors, etc. We adopt a one-on-one exclusive technical docking model, conduct in-depth research on customers’ actual application scenarios and product parameter requirements, and precisely match customers’ core demands.

2. Full-process Packaging and Mass Production Implementation

We have built an integrated chip packaging and production system covering R&D sampling to large-scale mass production, enabling full-process independent control and standardized delivery. Our services fully cover rapid prototype sampling and mainstream standard packaging processes such as BGA, QFN and DFN. We also support mass production and processing of various chip modules including high-definition camera modules and sensor modules. A rigorous quality control management system has been established to strictly control production and delivery schedules and standardize production procedures. We can efficiently meet customers’ diverse demands for small-batch trial production and large-volume mass production, ensuring both on-time delivery and qualified product quality.

3. Full-cycle Professional Technical Support Services

The company has assembled an experienced R&D technical team with years of deep engagement in the semiconductor industry, boasting abundant practical experience in chip development, hardware matching and mass production implementation to provide customers with exclusive full-cycle technical support services. Core services cover all-round technical assistance including precise PCB Layout routing design, customized development of production fixtures, product testing and commissioning, performance optimization and rectification. We track the entire process of project development, sampling and mass production to guarantee long-term stability and reliability of products, safeguarding the smooth implementation of customers’ projects.

4. Long-term After-sales Technical Operation and Maintenance Services

Adhering to the philosophy of "services never end upon delivery", we have established a comprehensive long-term after-sales technical operation and maintenance system to deliver sustainable and responsive after-sales guarantee services for customers. After product delivery, exclusive maintenance services are available, including rapid troubleshooting response, regular product performance retesting, production process optimization and product version iteration upgrades. Through regular after-sales follow-ups and periodic maintenance visits, we continuously improve product performance, cut customers’ production and operation costs, and ensure stable operation of customers’ production lines.

5. One-stop Value-added Supporting Services

To fully satisfy customers’ demands for long-term cooperation and scaled development, we have set up a one-stop value-added supporting service system to comprehensively empower customers’ full-chain procurement and production operations. For customers with bulk procurement needs, customized exclusive cost optimization solutions are offered to effectively reduce their procurement and production costs via process improvement, batch proportion adjustment and supply chain integration. In addition, we provide integrated supporting services including cargo import and export customs clearance, logistics and traceability, unblocking domestic and international supply channels. We deliver a full-closed-loop one-stop service spanning solution customization, product manufacturing, practical application and long-term supply, fully meeting customers’ core demands for stable long-term supply and scaled business operation.