0.56 MP RGB Global 160 - Degree View Shutter Camera Module VD65G4 Sensor For

Product Specification

0.56 MP RGB Global 160 - Degree View Shutter Camera Module VD65G4 Sensor For Machine Vision

1. Basic Parameters:

- Resolution: 804(H)×704(V), 0.56MP. It supports high‑speed full‑resolution frame output up to 184 fps, which can accurately capture fast‑moving scenes without motion blur or distortion.

- Pixel Size: 2.16 μm(H)×2.16 μm(V), adopting industry‑leading pixel technology. The pixel array has a diagonal of 2.3 mm. Featuring an ultra‑compact form factor, it suits the integration and installation requirements of various miniaturized and lightweight devices.

- Optical Format: 1/9‑inch. Built with BSI back‑illuminated, CDTI technology and 3D stacking process, it delivers excellent light‑sensing performance and optical response.

- Supply Voltage: Core voltage 1.15 V, interface voltage 1.8 V, analog voltage 2.8 V. It operates stably under various voltage conditions to ensure sensor reliability.

- Temperature Range: Operating temperature ranges from ‑30 ℃ to 85 ℃. Its wide operating temperature range enables adaptation to diverse working environments.

2. Technical Features:

- Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption requirements for lighting.

- Built‑in full‑set intelligent image‑processing algorithms integrate core functions including auto‑exposure, intelligent noise reduction, pixel defect correction, multi‑exposure optimization and auto‑white balance. High‑quality RAW8 and RAW10 image data can be directly output without an external image‑processing chip. It also supports professional vision functions such as 4×4 frame statistics output, event‑like frame output and background subtraction. These functions can rapidly distinguish foreground targets from background environments, significantly reduce the computing load of downstream main‑control MCUs and NPUs, shorten imaging response latency and improve overall equipment operational efficiency.

- Leveraging advanced semiconductor processes including 3D stacking, BSI back‑illumination and CDTI, it achieves ultra‑miniaturized design while preserving imaging performance. The chip features small dimensions and compact structure, alongside favorable photoelectric conversion efficiency and angular response characteristics, strong anti‑interference capability and consistent imaging quality. It is suitable for device integration scenarios with confined space.

- VD65G4 RGB Camera Module: Standard modules compatible with various lens configurations such as 179°, 160° and 81° to meet diverse customer requirements.

3. Application Fields:

Applied to virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Personalized Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching specific demands.