| Potting & Encapsulation Material | Thermally Conductive Epoxy / Silicone Potting (UL 94V-0 Rated) |
| Operating Frequency | 50 kHz – 300 kHz |
| Payment Terms | T/T |
| Power Density | Up to 45–60 W/cm³ |
| Winding Structure & Interleaving | Primary-Secondary Interleaving / Multi-layer PCB Planar / Flat Copper Ribbon |
| Winding Structure | Primary-Secondary Interleaving / Multi-layer PCB Planar / Flat Copper Ribbon |
| Delivery Time | 7-22 wark days |
| Creepage Distance | ≥ 8.0 mm |
| Packaging Details | Small transformers: blister tray packaging + export cartons; Large transformers packed on wooden pallets. Custom packaging available upon request. |
| Topology Compatibility | LLC Resonant, Full-Bridge, Half-Bridge, Phase-Shifted Full Bridge (PSFB), Push-Pull |
| Thermal Resistance | Custom thermal pad integration / Direct metal baseplate contact |
| Creepage & Clearance Distance | Clearance ≥ 6.0 mm / Creepage ≥ 8.0 mm (Meets IEC/UL 62368-1) |
| Pin Layout & Terminal Type | Through-Hole (THT) Pins, Heavy-Current Copper Lug, SMD, Custom Footprint |
| Clearance Distance | ≥ 6.0 mm |
| Supply Ability | 5000 pcs per day |
| Interwinding Capacitance | < 30 pF to 100 pF |
| Model Number | PQ5040 |
| Brand Name | CHIPSEN |
| Place of Origin | China |
| Certification | UL/cUL Class B/F/H, VDE, CQC |
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Product Specification
| Potting & Encapsulation Material | Thermally Conductive Epoxy / Silicone Potting (UL 94V-0 Rated) | Operating Frequency | 50 kHz – 300 kHz |
| Payment Terms | T/T | Power Density | Up to 45–60 W/cm³ |
| Winding Structure & Interleaving | Primary-Secondary Interleaving / Multi-layer PCB Planar / Flat Copper Ribbon | Winding Structure | Primary-Secondary Interleaving / Multi-layer PCB Planar / Flat Copper Ribbon |
| Delivery Time | 7-22 wark days | Creepage Distance | ≥ 8.0 mm |
| Packaging Details | Small transformers: blister tray packaging + export cartons; Large transformers packed on wooden pallets. Custom packaging available upon request. | Topology Compatibility | LLC Resonant, Full-Bridge, Half-Bridge, Phase-Shifted Full Bridge (PSFB), Push-Pull |
| Thermal Resistance | Custom thermal pad integration / Direct metal baseplate contact | Creepage & Clearance Distance | Clearance ≥ 6.0 mm / Creepage ≥ 8.0 mm (Meets IEC/UL 62368-1) |
| Pin Layout & Terminal Type | Through-Hole (THT) Pins, Heavy-Current Copper Lug, SMD, Custom Footprint | Clearance Distance | ≥ 6.0 mm |
| Supply Ability | 5000 pcs per day | Interwinding Capacitance | < 30 pF to 100 pF |
| Model Number | PQ5040 | Brand Name | CHIPSEN |
| Place of Origin | China | Certification | UL/cUL Class B/F/H, VDE, CQC |
| High Light | High Power Density Planar High Frequency Transformer ,Low Parasitic Capacitance Flyback Transformer ,Custom Thermal Pad Integration High Power Flat Wire Transformer | ||
| Category | Parameter Name | Standard / Typical Range | Customization Options |
|---|---|---|---|
| Structure & Material | Core Type | PQ5040 (PC40 / PC95 / N97) | Custom core sizes available (e.g., PQ32, PQ40, PQ50, PQ65) |
| Structure & Material | Winding Material | 100% High-Purity Oxygen-Free Flat Copper Wire | Litz wire or PCB planar winding available |
| Electrical Specs | Operating Frequency | 50 kHz – 300 kHz | Up to 500 kHz (Optimized for SiC / GaN designs) |
| Electrical Specs | Rated Power | 1 kW – 5 kW | Fully customizable up to 10 kW+ |
| Electrical Specs | Input Voltage | 85V – 265V AC / 400V – 800V DC | Tailored for Solar/ESS bus voltage and EV charger input |
| Electrical Specs | Output Voltage & Current | Multi-output: 5V – 300V / Current up to 100A+ | Custom turns ratio and multi-winding configurations |
| Electrical Specs | Primary Inductance (Lp) | 100 µH – 2000 µH (@100kHz, 1V) | Custom inductance with tight tolerance (±5%, ±10%) |
| Electrical Specs | Leakage Inductance (Llk) | < 1% of primary inductance | Ultra-low leakage design for ZVS / resonant converters |
| Safety & Insulation | Hi-Pot Isolation | Primary to Secondary: 3000V AC / 1mA / 60s | Reinforced insulation for higher safety standards |
| Mechanical & Thermal | Operating Temperature | -40°C to +125°C (Class B / F / H Insulation) | High-temp insulation & potted thermal management |
| Mechanical & Thermal | Mounting Type | Through-Hole (THT Pin Mount) | Custom pin layout, pitch, and baseplate cooling options |
| Compliance | Standards & Compliance | RoHS, REACH Compliant | Custom testing alignment for safety compliance |
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Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
28820000-29820000
Employee Number:
400~450
Ecer Certification:
Verified Supplier
Chipsen Electronics - Supplier to Fortune Global 500 Companies Magnetic Components Engineered for Performance & Reliability Founded in 2007, Dongguan Chipsen Electronics Technology Co., Ltd. is a professional manufacturer specializing in magnetic components and micro switches. ... Chipsen Electronics - Supplier to Fortune Global 500 Companies Magnetic Components Engineered for Performance & Reliability Founded in 2007, Dongguan Chipsen Electronics Technology Co., Ltd. is a professional manufacturer specializing in magnetic components and micro switches. ...
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