Beijing Silk Road Enterprise Management Services Co.,Ltd.
Products
Manufacturer of a wide range of products which include MC33364DR2,NCP1011AP130,5CSXFC6C6U23C7N,etc
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| Category | Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches |
| Control Features | Frequency Control |
| Product Status | Obsolete |
| Voltage - Start Up | 15 V |
| Mounting Type | Surface Mount |
| Frequency - Switching | 126kHz |
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® |
| Series | GreenLine™ |
| Fault Protection | Current Limiting, Over Temperature |
| Output Isolation | Isolated |
| Supplier Device Package | 16-SOIC |
| Mfr | onsemi |
| Voltage - Breakdown | 700V |
| Voltage - Supply (Vcc/Vdd) | 7.6V ~ 16V |
| Package / Case | 16-SOIC (0.154", 3.90mm Width), 14 Leads |
| Duty Cycle | - |
| Operating Temperature | -25°C ~ 125°C (TA) |
| Internal Switch(s) | No |
| Base Product Number | MC33364 |
| Topology | Flyback |
| Description | IC OFFLINE SWITCH FLYBACK 16SOIC |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | MC33364DR2 |
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| Category | Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches |
| Control Features | - |
| Product Status | Obsolete |
| Duty Cycle | 67% |
| Mounting Type | Through Hole |
| Frequency - Switching | 130kHz |
| Package | Tube |
| Series | - |
| Supplier Device Package | 7-PDIP |
| Output Isolation | Isolated |
| Mfr | onsemi |
| Power (Watts) | 19 W |
| Fault Protection | Over Load, Over Temperature, Over Voltage |
| Voltage - Breakdown | 700V |
| Voltage - Supply (Vcc/Vdd) | 8.5V ~ 10V |
| Package / Case | 8-DIP (0.300", 7.62mm), 7 Leads |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Internal Switch(s) | Yes |
| Base Product Number | NCP1011 |
| Topology | Flyback |
| Description | IC OFFLINE SWITCH FLYBACK 7DIP |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | NCP1011AP130 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | 5CSXFC6 |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 110K Logic Elements |
| Series | Cyclone® V SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 672-UBGA (23x23) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 672-FBGA |
| Number of I/O | MCU - 181, FPGA - 145 |
| RAM Size | 64KB |
| Speed | 800MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 800MHZ 672UBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | 5CSXFC6C6U23C7N |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 270K Logic Elements |
| Series | Arria 10 SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1152-BBGA, FCBGA |
| Number of I/O | 384 |
| RAM Size | 256KB |
| Speed | 1.5GHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | 10AS027H4F34E3SG |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | M2S060 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 60K Logic Modules |
| Series | SmartFusion®2 |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 400-VFBGA (17x17) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 400-LFBGA |
| Number of I/O | 207 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| Description | IC SOC CORTEX-M3 166MHZ 400VFBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | M2S060TS-VFG400 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | - |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 784-FCBGA (23x23) |
| Connectivity | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 784-BFBGA, FCBGA |
| Number of I/O | - |
| RAM Size | 256KB |
| Speed | 533MHz, 600MHz, 1.333GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC ZUP MPSOC EG A53 FPGA 784BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | XCZU1EG-2SFVC784I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, PCI, PWM |
| Primary Attributes | FPGA - 254K Logic Modules |
| Series | PolarFire® |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 484-FCBGA (19x19) |
| Connectivity | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C |
| Architecture | MPU, FPGA |
| Package / Case | 484-BFBGA, FCBGA |
| Number of I/O | MCU - 136, FPGA - 372 |
| RAM Size | 2.2MB |
| Speed | - |
| Core Processor | RISC-V |
| Flash Size | 128kB |
| Description | IC SOC RISC-V 484FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | MPFS250TLS-FCVG484I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | M2S150 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 150K Logic Modules |
| Series | SmartFusion®2 |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 536-CSPBGA (16x16) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 536-LFBGA, CSPBGA |
| Number of I/O | 293 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| Description | IC SOC CORTEX-M3 166MHZ 536BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | M2S150TS-1FCS536I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU4 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 784-FCBGA (23x23) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 784-BFBGA, FCBGA |
| Number of I/O | 252 |
| RAM Size | 256KB |
| Speed | 533MHz, 1.3GHz |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 784FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | XCZU4CG-2SFVC784E |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z045 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 900-FCBGA (31x31) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 900-BBGA, FCBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 900FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | XC7Z045-1FFG900I |
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