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Beijing Silk Road Enterprise Management Services Co.,LTD

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System On Chip (SoC)

Manufacturer of a wide range of products which include LYT4222E,VIPER17HN,10AS057K4F35E3SG,etc

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Category Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches
Control Features -
Product Status Obsolete
Duty Cycle 99.9%
Mounting Type Through Hole
Frequency - Switching 140kHz
Package Tube
Series LYTSwitch™-4
Supplier Device Package eSIP-7C
Output Isolation Isolated
Mfr Power Integrations
Power (Watts) 15 W
Fault Protection -
Voltage - Breakdown 725V
Voltage - Supply (Vcc/Vdd) -
Package / Case 7-SSIP, 6 Leads, Exposed Pad, Formed Leads
Operating Temperature -40°C ~ 150°C (TJ)
Internal Switch(s) Yes
Base Product Number LYT4222
Topology Flyback, Step-Down (Buck), Step-Up (Boost)
Description IC OFFLINE SWITCH MULT TOP 7ESIP
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches
Control Features -
Product Status Active
Voltage - Start Up 14 V
Mounting Type Through Hole
Frequency - Switching 115kHz
Package Tube
Series VIPer™ plus
Supplier Device Package 8-DIP
Output Isolation Isolated
Mfr STMicroelectronics
Power (Watts) 10 W
Fault Protection Current Limiting, Over Temperature, Over Voltage
Voltage - Breakdown 800V
Voltage - Supply (Vcc/Vdd) 8.5V ~ 23.5V
Package / Case 8-DIP (0.300", 7.62mm), 7 Leads
Duty Cycle 70%
Operating Temperature -40°C ~ 150°C (TJ)
Internal Switch(s) Yes
Base Product Number VIPER17
Topology Flyback
Description IC OFFLINE SWITCH FLYBACK 8DIP
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 570K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1152-FBGA, FC (35x35)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1152-BBGA, FCBGA
Number of I/O 396
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S010
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 10K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 400-VFBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA
Number of I/O 195
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 400VFBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 480K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 780-FBGA, FC (29x29)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 780-BBGA, FCBGA
Number of I/O 360
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 780FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Primary Attributes FPGA - 1650K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1760-FBGA (42.5x42.5)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1760-BBGA, FCBGA
Peripherals DMA, WDT
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
Description IC FPGA STRATIX 10 1760FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S050
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 50K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 400-VFBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA
Number of I/O 207
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 400VFBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Primary Attributes FPGA - 2800K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 2397-FBGA, FC (50x50)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 2397-BBGA, FCBGA
Peripherals DMA, WDT
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
Description IC FPGA STRATIX 10 2397FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, PCI, PWM
Primary Attributes FPGA - 161K Logic Modules
Series PolarFire®
Package Tray
Mfr Microchip Technology
Supplier Device Package 536-LFBGA
Connectivity CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C
Architecture MPU, FPGA
Package / Case 536-BGA
Number of I/O MCU - 136, FPGA - 312
RAM Size 1.4125MB
Speed -
Core Processor RISC-V
Flash Size 128kB
Description IC SOC RISC-V 536LFBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XC7Z045
Product Status Active
Peripherals DMA
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Series Zynq®-7000
Package Tray
Mfr AMD
Supplier Device Package 900-FCBGA (31x31)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 900-BBGA, FCBGA
Number of I/O 130
RAM Size 256KB
Speed 800MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,

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