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Systems on a Chip - SoC

Manufacturer of a wide range of products which include M2S050TS-FGG896,5CSEMA4U23C8N,XC7Z007S-2CLG225I,etc

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M2S050TS-FGG896

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Package / Case : 896-BGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 50K Logic Modules
Speed : 166MHz
Supplier Device Package : 896-FBGA (31x31)
Flash Size : 256kB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : 0°C ~ 85°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 896FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number M2S050TS-FGG896

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5CSEMA4U23C8N

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Package / Case : 672-FBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 40K Logic Elements
Speed : 600MHz
Supplier Device Package : 672-UBGA (23x23)
Flash Size : -
RAM Size : 64kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : 0°C ~ 85°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Product status : Active
Peripherals : DMA, POR, WDT
Series : Cyclone® V SE
Manufacturer : Intel
Description IC SOC CORTEX-A9 600MHZ 672UBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number 5CSEMA4U23C8N

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XC7Z007S-2CLG225I

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Package / Case : 225-LFBGA, CSPBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Artix™-7 FPGA, 23K Logic Cells
Speed : 766MHz
Supplier Device Package : 225-CSPBGA (13x13)
Flash Size : -
RAM Size : 256kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : -40°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Product status : Active
Peripherals : DMA
Series : Zynq®-7000
Manufacturer : Xilinx Inc
Description IC SOC CORTEX-A9 766MHZ 225BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number XC7Z007S-2CLG225I

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XAZU3EG-L1SFVA625I

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Package / Case : 625-BFBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Speed : 500MHz, 1.2GHz
Supplier Device Package : 625-FCBGA (21x21)
Flash Size : -
RAM Size : 1.8MB
Connectivity : CANbus, I²C, SPI, UART/USART, USB
Operating Temperature : -40°C ~ 100°C (TJ)
Package : Tray
Architecture : MPU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Product status : Active
Peripherals : DMA, WDT
Series : Zynq® UltraScale+™ MPSoC EG
Manufacturer : Xilinx Inc
Description IC SOC CORTEX-A53 625FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number XAZU3EG-L1SFVA625I

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Quality 10AS016E3F27I2LG for sale

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10AS016E3F27I2LG

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Package / Case : 672-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 160K Logic Elements
Speed : 1.5GHz
Supplier Device Package : 672-FBGA, FC (27x27)
Flash Size : -
RAM Size : 256kB
Connectivity : EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : -40°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Product status : Active
Peripherals : DMA, POR, WDT
Series : Arria 10 SX
Manufacturer : Intel
Description IC SOC CORTEX-A9 1.5GHZ 672FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number 10AS016E3F27I2LG

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Quality 71M6532F-IGT/F for sale

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71M6532F-IGT/F

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Product Category : Systems on a Chip - SoC
Mounting Style : SMD/SMT
ADC Resolution : 22 bit
Package / Case : LQFP-100
Maximum Operating Temperature : + 85 C
Data Bus Width : 8 bit
Core : 80515
Data RAM Size : 4 kB
Operating Supply Voltage : 3.3 V
Program Memory Size : 256 kB
Maximum Clock Frequency : 10 MHz
Manufacturer : Maxim Integrated
Description Metering Systems on a Chip - SoC Residential Energy Meter IC
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number 71M6532F-IGT/F

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Quality M2S050TS-1FG484M for sale

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M2S050TS-1FG484M

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Package / Case : 484-BGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 50K Logic Modules
Speed : 166MHz
Supplier Device Package : 484-FPBGA (23x23)
Flash Size : 256kB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : -55°C ~ 125°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 484FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number M2S050TS-1FG484M

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M2S025T-1FGG484M

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Package / Case : 484-BGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 25K Logic Modules
Speed : 166MHz
Supplier Device Package : 484-FPBGA (23x23)
Flash Size : 256kB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : -55°C ~ 125°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 484FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number M2S025T-1FGG484M

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XCZU7CG-1FBVB900E

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Package / Case : 900-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Speed : 500MHz, 1.2GHz
Supplier Device Package : 900-FCBGA (31x31)
Flash Size : -
RAM Size : 256kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : 0°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Product status : Active
Peripherals : DMA, WDT
Series : Zynq® UltraScale+™ MPSoC CG
Manufacturer : Xilinx Inc
Description IC SOC CORTEX-A53 900FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number XCZU7CG-1FBVB900E

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XCZU48DR-1FSVE1156I

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Package / Case : 1156-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Speed : 500MHz, 1.2GHz
Supplier Device Package : 1156-FCBGA (35x35)
Flash Size : -
RAM Size : 256kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : -40°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Product status : Active
Peripherals : DDR, DMA, PCIe
Series : Zynq® UltraScale+™ RFSoC
Manufacturer : Xilinx Inc
Description IC ZUP RFSOC A53 FPGA 1156BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union,
Model Number XCZU48DR-1FSVE1156I

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