Beijing Silk Road Enterprise Management Services Co.,Ltd.
Products
Manufacturer of a wide range of products which include MC33364DR2,NCP1011AP130,M2S050TS-FGG896,etc
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| Category | Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches |
| Control Features | Frequency Control |
| Product Status | Obsolete |
| Voltage - Start Up | 15 V |
| Mounting Type | Surface Mount |
| Frequency - Switching | 126kHz |
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® |
| Series | GreenLine™ |
| Fault Protection | Current Limiting, Over Temperature |
| Output Isolation | Isolated |
| Supplier Device Package | 16-SOIC |
| Mfr | onsemi |
| Voltage - Breakdown | 700V |
| Voltage - Supply (Vcc/Vdd) | 7.6V ~ 16V |
| Package / Case | 16-SOIC (0.154", 3.90mm Width), 14 Leads |
| Duty Cycle | - |
| Operating Temperature | -25°C ~ 125°C (TA) |
| Internal Switch(s) | No |
| Base Product Number | MC33364 |
| Topology | Flyback |
| Description | IC OFFLINE SWITCH FLYBACK 16SOIC |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | MC33364DR2 |
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| Category | Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches |
| Control Features | - |
| Product Status | Obsolete |
| Duty Cycle | 67% |
| Mounting Type | Through Hole |
| Frequency - Switching | 130kHz |
| Package | Tube |
| Series | - |
| Supplier Device Package | 7-PDIP |
| Output Isolation | Isolated |
| Mfr | onsemi |
| Power (Watts) | 19 W |
| Fault Protection | Over Load, Over Temperature, Over Voltage |
| Voltage - Breakdown | 700V |
| Voltage - Supply (Vcc/Vdd) | 8.5V ~ 10V |
| Package / Case | 8-DIP (0.300", 7.62mm), 7 Leads |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Internal Switch(s) | Yes |
| Base Product Number | NCP1011 |
| Topology | Flyback |
| Description | IC OFFLINE SWITCH FLYBACK 7DIP |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | NCP1011AP130 |
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| Package / Case : | 896-BGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 50K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 896-FBGA (31x31) |
| Flash Size : | 256kB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | 0°C ~ 85°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 896FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | M2S050TS-FGG896 |
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| Package / Case : | 672-FBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 40K Logic Elements |
| Speed : | 600MHz |
| Supplier Device Package : | 672-UBGA (23x23) |
| Flash Size : | - |
| RAM Size : | 64kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | 0°C ~ 85°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Active |
| Peripherals : | DMA, POR, WDT |
| Series : | Cyclone® V SE |
| Manufacturer : | Intel |
| Description | IC SOC CORTEX-A9 600MHZ 672UBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | 5CSEMA4U23C8N |
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| Package / Case : | 225-LFBGA, CSPBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Artix™-7 FPGA, 23K Logic Cells |
| Speed : | 766MHz |
| Supplier Device Package : | 225-CSPBGA (13x13) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Active |
| Peripherals : | DMA |
| Series : | Zynq®-7000 |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A9 766MHZ 225BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | XC7Z007S-2CLG225I |
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| Package / Case : | 625-BFBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Speed : | 500MHz, 1.2GHz |
| Supplier Device Package : | 625-FCBGA (21x21) |
| Flash Size : | - |
| RAM Size : | 1.8MB |
| Connectivity : | CANbus, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MPU, FPGA |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC EG |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 625FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | XAZU3EG-L1SFVA625I |
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| Package / Case : | 672-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 160K Logic Elements |
| Speed : | 1.5GHz |
| Supplier Device Package : | 672-FBGA, FC (27x27) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Active |
| Peripherals : | DMA, POR, WDT |
| Series : | Arria 10 SX |
| Manufacturer : | Intel |
| Description | IC SOC CORTEX-A9 1.5GHZ 672FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | 10AS016E3F27I2LG |
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| Product Category : | Systems on a Chip - SoC |
| Mounting Style : | SMD/SMT |
| ADC Resolution : | 22 bit |
| Package / Case : | LQFP-100 |
| Maximum Operating Temperature : | + 85 C |
| Data Bus Width : | 8 bit |
| Core : | 80515 |
| Data RAM Size : | 4 kB |
| Operating Supply Voltage : | 3.3 V |
| Program Memory Size : | 256 kB |
| Maximum Clock Frequency : | 10 MHz |
| Manufacturer : | Maxim Integrated |
| Description | Metering Systems on a Chip - SoC Residential Energy Meter IC |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | 71M6532F-IGT/F |
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| Package / Case : | 484-BGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 50K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 484-FPBGA (23x23) |
| Flash Size : | 256kB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -55°C ~ 125°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 484FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | M2S050TS-1FG484M |
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| Package / Case : | 484-BGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 25K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 484-FPBGA (23x23) |
| Flash Size : | 256kB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -55°C ~ 125°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 484FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
| Model Number | M2S025T-1FGG484M |
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