F4BTMS233 0.127mm 0.254mm 0.508mm double layer Copper-Clad Laminate Low-Loss

Product Specification

F4BTMS233 Copper-Clad Laminate: A High-Reliability, Low-Loss Substrate for Advanced Aerospace and RF Applications

We are pleased to introduce the F4BTMS233, a premium-grade, ceramic-filled PTFE laminate from Taizhou Wangling Insulation Material Factory. This material represents a significant technological advancement, engineered to deliver exceptional electrical performance, outstanding dimensional stability, and high reliability, making it a robust domestic alternative to imported high-frequency substrates for the most demanding aerospace, defense, and telecommunications applications.

Material Composition for Performance
The F4BTMS233 is formulated with a sophisticated blend of PTFE resin, ultra-thin and ultra-fine glass fiber cloth, and a high loading of specialized nano-ceramic fillers. This unique composition minimizes the "glass weave effect" during electromagnetic wave propagation, leading to extremely low dielectric loss. Simultaneously, the ceramic fillers significantly enhance dimensional stability, reduce anisotropy in the X, Y, and Z directions, improve thermal conductivity, and increase electrical strength, creating a well-balanced material ideal for precision circuits.

Electrical Characteristics
The F4BTMS233 is designed for predictable, high-performance operation up to 40 GHz and beyond:

• Stable Low Dielectric Constant: A consistent Dk of 2.33 (Typical & Design Value at 10 GHz) with a tight tolerance of ±0.03.
• Ultra-Low Loss: An impressive Dissipation Factor (Df) of 0.0010 at 10 GHz, rising only to 0.0015 at 40 GHz, ensuring minimal signal attenuation for phase-sensitive applications like phased array antennas.
• Excellent Thermal Stability: Features a low Dielectric Constant Temperature Coefficient (TCDk) of -122 ppm/°C over a wide range of -55°C to +150°C, guaranteeing stable electrical performance across extreme environmental conditions.

Mechanical, Thermal, and Environmental Properties
Built for harsh environments and reliable manufacturing:

• Superior Bond Strength: High Peel Strength >2.4 N/mm with standard 1 oz RTF copper foil.
• Excellent Dimensional Stability: Low and balanced CTE (35-40 ppm/°C in X/Y, 220 ppm/°C in Z) ensures reliability during thermal cycling and supports high multilayer and HDI processing.
• High Thermal Conductivity: 0.28 W/(m·K) in the Z-direction, facilitating better heat dissipation for higher-power applications.
• Space-Qualified Reliability: Exhibits very low moisture absorption (0.02%), meets vacuum outgassing  requirements, and offers excellent radiation resistance, making it suitable for spaceborne electronics. It also carries a UL 94 V-0 flammability rating.

Standard Specifications for F4BTMS233:

• Dielectric Constant (Dk): 2.33 ± 0.03 @ 10 GHz
• Dissipation Factor (Df): 0.0010 @ 10 GHz; 0.0015 @ 40 GHz

Standard Thickness Range & Tolerance: Available from an ultra-thin 0.09mm (3.5 mil). Common thicknesses follow multiples of 0.09mm or 0.127mm (5 mil). For example:

• 0.127mm ±0.0127mm
• 0.254mm ±0.02mm
• 0.508mm ±0.03mm

Standard Panel Sizes:

305 x 460 mm (12" x 18")

460 x 610 mm (18" x 24")

610 x 920 mm (24" x 36")

Standard Cladding: Configured with 1 oz (0.035mm) RTF (Low Profile) copper foil by default. Options for 0.5 oz foil, 50Ω buried resistive foil, aluminum base (AL), or copper base (CU) are available.

Key Property Benchmarks:

• Volume/Surface Resistivity: ≥1x10⁸ MΩ·cm / MΩ
• Electric Strength (Z): >30 kV/mm
• Operating Temperature: -55°C to +260°C
• Density: 2.22 g/cm³

Application Areas

• Aerospace & Satellite Communication Payloads
• Phased Array and Phase-Sensitive Antennas
• Military and Civilian Radar Systems
• High-Frequency RF/Microwave Circuits and Feed Networks
• High-Layer-Count and HDI Multilayer Boards

In summary, the F4BTMS233 delivers a compelling combination of ultra-low loss, outstanding stability, and proven reliability, tailored for next-generation high-frequency systems where performance cannot be compromised. Contact us today to discuss your project specifications, request samples, or receive a detailed quotation.