| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | |
| Model Number | Megtron6 |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | Model Number | Megtron6 | |
| Certification | ISO9001 | Place of Origin | China |
Product Description: 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate
This 12-layer PCB, built using Megtron6 (M6) high-speed, low-loss laminate, offers a cutting-edge solution for applications requiring exceptional signal integrity, thermal reliability, and high-frequency performance. Its robust construction, precise impedance control, and compliance with IPC-Class-3 standards make it an ideal choice for 5G communication systems, automotive electronics, data centers, and aerospace applications. Below, we analyze its features, advantages, and disadvantages.
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Key Construction Details
| Parameter | Specification |
| Layer Count | 12 layers |
| Base Material | Megtron6 (M6) |
| Dimensions | 220mm x 60mm (±0.15mm) |
| Finished Thickness | 2.12mm |
| Copper Weight | Outer: 1oz (35μm), Inner: 0.5oz/1oz |
| Minimum Trace/Space | 3/3 mils |
| Minimum Hole Size | 0.2mm |
| Via Plating Thickness | 25μm |
| Vias | 0.2mm/0.4mm filled with resin and capped plating |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Top: Blue, Bottom: Blue |
| Silkscreen | Top: White, Bottom: White |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Prepreg Layer 1 | R-5670 1080 (68%) | 81.4μm |
| Copper Layer 2 | Copper (1oz) | 35μm |
| Core Layer 1 | M6 R5775G (HVLP) | 75μm |
| Copper Layers 3-10 | Copper (0.5oz) | 17μm |
| Core Layers | M6 R5775G (HVLP) | 75-400μm |
| Copper Layer 11 | Copper (1oz) | 35μm |
| Prepreg Layer 2 | R-5670 1080 (68%) | 81.4μm |
| Copper Layer 12 | Copper (1oz) | 35μm |
Advantages
High-Speed and Low-Loss Performance
Flexible Design Compatibility
Wide Application Range
Disadvantages
The use of Megtron6 laminates and high-precision construction increases production costs, making this PCB less suitable for cost-sensitive applications.
The 3/3 mil trace/space, resin-filled vias, and 12-layer stackup demand advanced manufacturing processes, limiting availability to specialized manufacturers.
The PCB is optimized for high-speed and high-reliability environments, making it over-engineered for simpler or low-frequency designs.
Conclusion
The 12-layer Megtron6 PCB is a high-performance, high-frequency solution tailored for demanding industries like 5G, automotive, aerospace, and HPC. Its low dielectric loss, precise impedance control, and thermal reliability ensure top-tier performance in critical applications. While it offers exceptional capabilities, the higher cost and complex manufacturing requirements may limit its use in general-purpose or low-budget designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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