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Shenzhen Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
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China 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm
China 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm

  1. China 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm
  2. China 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm
  3. China 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm

12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate with both sided 35μm

  1. MOQ: 1PCS
  2. Price: 0.99-99USD/PCS
  3. Get Latest Price
Payment Terms T/T, Paypal
Supply Ability 50000pcs
Delivery Time 2-10 working days
Packaging Details Packing
Brand Name
Model Number Megtron6
Certification ISO9001
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Paypal Supply Ability 50000pcs
Delivery Time 2-10 working days Packaging Details Packing
Brand Name Model Number Megtron6
Certification ISO9001 Place of Origin China

Product Description: 12-Layer High-Speed PCB Built on Megtron6 (M6) Laminate

 

 

This 12-layer PCB, built using Megtron6 (M6) high-speed, low-loss laminate, offers a cutting-edge solution for applications requiring exceptional signal integrity, thermal reliability, and high-frequency performance. Its robust construction, precise impedance control, and compliance with IPC-Class-3 standards make it an ideal choice for 5G communication systems, automotive electronics, data centers, and aerospace applications. Below, we analyze its features, advantages, and disadvantages.

 

 

Key Construction Details

Parameter Specification
Layer Count 12 layers
Base Material Megtron6 (M6)
Dimensions 220mm x 60mm (±0.15mm)
Finished Thickness 2.12mm
Copper Weight Outer: 1oz (35μm), Inner: 0.5oz/1oz
Minimum Trace/Space 3/3 mils
Minimum Hole Size 0.2mm
Via Plating Thickness 25μm
Vias 0.2mm/0.4mm filled with resin and capped plating
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Solder Mask Top: Blue, Bottom: Blue
Silkscreen Top: White, Bottom: White
Electrical Testing 100% tested before shipment

 

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35μm
Prepreg Layer 1 R-5670 1080 (68%) 81.4μm
Copper Layer 2 Copper (1oz) 35μm
Core Layer 1 M6 R5775G (HVLP) 75μm
Copper Layers 3-10 Copper (0.5oz) 17μm
Core Layers M6 R5775G (HVLP) 75-400μm
Copper Layer 11 Copper (1oz) 35μm
Prepreg Layer 2 R-5670 1080 (68%) 81.4μm
Copper Layer 12 Copper (1oz) 35μm

 

 

Advantages

 

High-Speed and Low-Loss Performance

  • Megtron6 laminate provides a low dielectric constant (Dk) of 3.34 at 13GHz and a low dissipation factor (Df) of 0.0037 at 13GHz. This ensures minimal signal loss and high-speed signal integrity for 5G, radar, and server applications.
  • The material’s high Tg (>185°C) and thermal decomposition temperature (Td) of 410°C allow it to perform reliably in high-temperature environments.

 

 

Flexible Design Compatibility

  • The use of Megtron6, which is compatible with traditional FR-4 processing techniques, reduces manufacturing complexity and cost compared to other high-speed materials.
  • The PCB supports multi-layer designs ranging from 4 to 30 layers, making it suitable for various complex applications.

 

 

Wide Application Range

  1. 5G base stations (millimeter-wave antennas, RF front ends).
  2. Automotive electronics (77GHz radar, ADAS).
  3. Data centers (high-speed servers, optical modules).
  4. Aerospace (satellite communication, high-frequency radar systems).
  5. Consumer electronics (Wi-Fi 6E/7 routers, AR/VR devices).

 

 

Disadvantages

The use of Megtron6 laminates and high-precision construction increases production costs, making this PCB less suitable for cost-sensitive applications.

 

The 3/3 mil trace/space, resin-filled vias, and 12-layer stackup demand advanced manufacturing processes, limiting availability to specialized manufacturers.

 

The PCB is optimized for high-speed and high-reliability environments, making it over-engineered for simpler or low-frequency designs.

 

 

Conclusion

The 12-layer Megtron6 PCB is a high-performance, high-frequency solution tailored for demanding industries like 5G, automotive, aerospace, and HPC. Its low dielectric loss, precise impedance control, and thermal reliability ensure top-tier performance in critical applications. While it offers exceptional capabilities, the higher cost and complex manufacturing requirements may limit its use in general-purpose or low-budget designs.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Site Member

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...

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  • Shenzhen Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
  • https://www.circuitboardpcbs.com/

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