| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | F4B |
| Model Number | F4BTMS220 |
| Certification | ISO9001 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | F4B | Model Number | F4BTMS220 |
| Certification | ISO9001 | Place of Origin | China |
F4BTMS220 PCB: 2-Layer, 5mil Core, 0.2mm Thickness, Black Solder Mask with Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of F4BTMS220 2-Layer PCB
The F4BTMS220 PCB is a 2-layer rigid PCB designed for high-frequency, aerospace, and RF applications. Built with F4BTMS220 laminates, this PCB offers a 5mil core and a finished thickness of 0.2mm, delivering exceptional dimensional stability, low dielectric loss, and enhanced thermal conductivity. The black solder mask, combined with a white silkscreen on the top layer, provides a clean, professional finish, while the immersion gold surface finish ensures superior solderability and corrosion resistance.
With a dielectric constant (Dk) of 2.2 ± 0.02 at 10 GHz and dissipation factor as low as 0.0009, the F4BTMS220 PCB is an ideal choice for microwave, radar, and satellite communication systems.
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PCB Construction Details
| Parameter | Specification |
| Base Material | F4BTMS220 |
| Layer Count | 2 layers |
| Board Dimensions | 114mm x 20mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | None |
| Finished Thickness | 0.2mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Black |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | F4BTMS220 Core | 0.127mm (5mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to F4BTMS220 Material
The F4BTMS220 laminate is a technologically advanced material designed for high-reliability applications. It features a unique combination of nano-ceramics, PTFE resin, and ultra-thin glass fiber cloth, which minimizes dielectric loss and improves dimensional stability. The material's low anisotropy and enhanced thermal conductivity make it an excellent choice for microwave and RF circuits.
Key Features of F4BTMS220
Benefits of F4BTMS220
Applications
Aerospace Equipment
Microwave and RF Circuits
Radar Systems
Feed Networks
Phased Array Antennas
Satellite Communications
Conclusion
The F4BTMS220 2-layer PCB is a top-tier solution for aerospace, RF, and microwave applications, offering low dielectric loss, thermal stability, and dimensional accuracy. With its 5mil core, black solder mask, and immersion gold finish, this PCB delivers high reliability and exceptional performance for critical systems such as radar arrays, satellite communications, and phased antennas.
Compliant with IPC-Class-2 standards and available worldwide, the F4BTMS220 PCB is the perfect choice for engineers seeking cutting-edge, high-frequency PCB solutions.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. has established itself as a reliable high-frequency PCB supplier and exporter based in Shenzhen, China. For over 24 years, we have served industries worldwide, including cellular base station antennas, satellite communi...
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