Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 10000pcs |
| Delivery Time | 2-10 working day |
| Brand Name | Rogers |
| Model Number | RO4350B + RO4450F |
| Place of Origin | USA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000pcs |
| Delivery Time | 2-10 working day | Brand Name | Rogers |
| Model Number | RO4350B + RO4450F | Place of Origin | USA |
18-Layer High-Frequency PCB – RO4350B + RO4450F Stackup for RF/Microwave Applications
The newly shipped 18-layer high-frequency PCB is designed for demanding RF and microwave applications, utilizing Rogers RO4350B laminates and RO4450F bondply to achieve exceptional signal integrity, thermal stability, and low-loss performance. It is intended for mission-critical systems such as cellular base stations, automotive radar, and satellite communications. Compliance with IPC-Class 2 standards is ensured, and rigorous electrical testing is conducted prior to shipment to guarantee reliability.
Key Specifications:
PCB Specifications
| PCB SIZE | 135 x 135mm=1PCS |
| BOARD TYPE | High frequency PCB, RF PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4350B 60mil | |
| copper ------- 35um(1oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11mil/12mil |
| Minimum / Maximum Holes: | 0.3/2.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 184 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 60mil, Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advanced Material Benefits:
✅ RO4350B Core:
Ultra-low loss is achieved (Dk = 3.48 ±0.05 @ 10 GHz, Df = 0.0037).
High thermal conductivity (0.69 W/m/°K) and Tg >280°C are provided.
CTE is matched to copper (X/Y/Z: 10/12/32 ppm/°C) for reliable plated through-holes.
✅ RO4450F Bondply:
A compatible dielectric (Dk = 3.52 ±0.05) is ensured for multilayer stability.
Superior lateral flow is enabled for high-density interconnects.
Multiple sequential lamination cycles are supported.
Data sheet of Rogers 4350B (RO4350B )
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Design and Manufacturing Excellence:
High-Density Interconnects: 632 vias and 779 pads (338 thru-hole, 441 SMT) are integrated.
Controlled Impedance: Tight Dk tolerance is maintained for consistent RF performance.
Robust Construction: Resin-filled vias and press-fit holes are included for mechanical durability.
Typical Applications:
Why This PCB Is Selected
This PCB is engineered for high-frequency, high-power RF systems, where Rogers’ advanced materials are leveraged to minimize signal loss, enhance thermal management, and ensure long-term reliability in harsh operating conditions.
For customization or volume pricing, inquiries are welcomed.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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