Rogers RO4360G2 high frequency PCB 2-layer rigid PCB Substrate - 24mil (0.61mm)

Product Specification

Empowering Innovation with Rogers RO4360G2 High-Frequency PCBs

Introduction:
Redefining the realm of high-frequency circuitry, Rogers RO4360G2 laminates stand out as the epitome of cutting-edge technology, offering unmatched performance in a versatile and cost-effective package. Designed to meet the demands of modern electronics, the RO4360G2 laminates present a fusion of high dielectric constant (Dk), low loss characteristics, and lead-free process compatibility, setting a new standard for PCB excellence.

Features:
RO4360G2 boasts impressive specifications that include a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C and a dissipation factor of 0.0038, ensuring minimal signal loss and superior performance. With a high thermal conductivity of 0.75 W/mK and a low Z-axis coefficient of thermal expansion, these laminates provide exceptional reliability and stability in diverse operating conditions. The lead-free process compatibility and 94V-0 flammability rating make RO4360G2 environmentally friendly and safe for a wide range of applications.

Benefits:
The design flexibility and reliability of RO4360G2 laminates offer unparalleled freedom for circuit designers, enabling complex multi-layer board constructions with ease. With plated through-hole reliability and automated assembly compatibility, these laminates streamline the manufacturing process and reduce material and fabrication costs. The efficient supply chain and short lead times make RO4360G2 a cost-effective solution without compromising on performance or quality.

Q: What are the key advantages of using RO4360G2 laminates in high-frequency applications?
A: RO4360G2 laminates offer low loss characteristics, high dielectric constant, and excellent thermal stability, making them ideal for high-frequency applications where signal integrity and reliability are crucial.

Q: How does the thermal conductivity of RO4360G2 laminates impact the overall performance of the PCB?
A: The high thermal conductivity of 0.75 W/mK in RO4360G2 laminates helps dissipate heat efficiently, ensuring optimal thermal management and enhancing the overall performance and reliability of the PCB in demanding operating conditions.

Q: Can RO4360G2 laminates be used in multi-layer board constructions?
A: Yes, RO4360G2 laminates are well-suited for multi-layer board constructions and can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in complex PCB designs, offering design flexibility and cost-effective solutions for a wide range of applications.

PCB Construction Details:

- Board dimensions: 76.48mm x 43.52 mm=1PCS
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.30mm
- No Blind vias.
- Finished board thickness: 0.73mm
- Finished Cu weight: 1 oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion tin
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
- 0.3mm via filled by resin and capped

Data Sheet of RO4360BG2​

Applications:
RO4360G2 PCBs find their niche in a wide range of applications, including base station power amplifiers and small cell transceivers, where high-frequency performance and reliability are paramount. Whether in telecommunications or industrial electronics, these laminates excel in delivering exceptional results.

Conclusion:
Experience the pinnacle of high-frequency PCB technology with Rogers RO4360G2 laminates. With a perfect blend of performance, reliability, and cost-effectiveness, these PCBs empower innovation and unlock new possibilities in the world of electronics.