Shenzhen Bicheng Electronics Technology Co., Ltd
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Product Specification
Introducing TSM-DS3 PCB: A High-Performance Solution for Demanding Applications
TSM-DS3, a cutting-edge ceramic-filled reinforced material with a mere 5% fiberglass content, has emerged as a game-changer in the realm of advanced circuit board manufacturing. This material, which competes head-to-head with traditional epoxies, excels in fabricating large format complex multilayers with unparalleled precision and reliability.
Q: What sets TSM-DS3 apart from traditional epoxy materials in circuit board manufacturing?
A: TSM-DS3 boasts a remarkably low dissipation factor of 0.0011 at 10 GHz, setting a new standard in the industry. Its high thermal conductivity of 0.65 W/m*K effectively dissipates heat away from critical components within a printed wiring board (PWB) design. Additionally, TSM-DS3 showcases minimal coefficients of thermal expansion, ensuring optimal performance in environments with demanding thermal cycling requirements.
TSM-DS3 Typical Values
| Property | Test Method | Unit | TSM-DS3 | Unit | TSM-DS3 |
| Dk | IPC-650 2.5.5.3 | 3.00 | 3.00 | ||
| TcK (-30 to 120 °C) | IPC-650 2.5.5.5.1 (Modified) | ppm | 5.4 | ppm | 5.4 |
| Df | IPC-650 2.5.5.5.1 (Modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6 (ASTM D 149) | kV | 47.5 | kV | 47.5 |
| Dielectric Strength | ASTM D 149 (Through Plane) | V/mil | 548 | V/mm | 21,575 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 226 | Seconds | 226 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.07 | % | 0.07 |
| Flexural Strength (MD) | ASTM D 790/ IPC-650 2.4.4 | psi | 11,811 | N/mm2 | 81 |
| Flexural Strength (CD) | ASTM D 790/ IPC-650 2.4.4 | psi | 7,512 | N/mm2 | 51 |
| Tensile Strength (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 7,030 | N/mm2 | 48 |
| Tensile Strength (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 3,830 | N/mm2 | 26 |
| Elongation at Break (MD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.6 | % | 1.6 |
| Elongation at Break (CD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.5 | % | 1.5 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 973,000 | N/mm2 | 6,708 |
| Young’s Modulus (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 984,000 | N/mm2 | 6,784 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-650 2.4.19 | 0.24 | 0.24 | ||
| Poisson’s Ratio (CD) | ASTM D 3039/IPC-650 2.4.19 | 0.20 | 0.20 | ||
| Compressive Modulus | ASTM D 695 (23.C) | psi | 310,000 | N/mm2 | 2,137 |
| Flexural Modulus (MD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,860 | N/mm2 | 12,824 |
| Flexural Modulus (CD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,740 | N/mm2 | 11,996 |
| Peel Strength (CV1) | IPC-650 2.4.8 Sec 5.2.2 (TS) | lbs/in | 8 | N/mm | 1.46 |
| Thermal Conductivity (unclad) | ASTM F 433/ASTM 1530-06 | W/M*K | 0.65 | W/M*K | 0.65 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.21 | mm/M | 0.21 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.20 | mm/M | 0.20 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.15 | mm/M | 0.15 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.10 | mm/M | 0.10 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms | 2.3 x 10^6 | Mohms | 2.3 x 10^6 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms | 2.1 x 10^7 | Mohms | 2.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms/cm | 1.1 x 10^7 | Mohms/cm | 1.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms/cm | 1.8 x 10^8 | Mohms/cm | 1.8 x 10^8 |
| CTE (x axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 10 | ppm/ºC | 10 |
| CTE (y axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 16 | ppm/ºC | 16 |
| CTE (z axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 23 | ppm/ºC | 23 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.11 | g/cm3 | 2.11 |
| Hardness | ASTM D 2240 (Shore D) | 79 | 79 | ||
| Td (2% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 526 | ºC | 526 |
| Td (5% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 551 | ºC | 551 |
Q: What are the key features of TSM-DS3 that make it an ideal choice for high-power applications?
A: The dielectric constant of 3.0 with tight tolerances, a dissipation factor of 0.0014 at 10 GHz, and a high thermal conductivity of 0.65 W/MK (unclad) are some of the standout features of TSM-DS3. Moreover, its low moisture absorption rate and matched copper coefficient of thermal expansion in all axes enhance its suitability for high-power applications.
Q: How does TSM-DS3 facilitate the construction of complex PCBs with consistency and predictability?
A: With a low fiberglass content (~5%) and dimensional stability rivaling epoxy materials, TSM-DS3 enables the production of large format high layer count PCBs with ease. This material's compatibility with resistive foils and temperature stability across a wide range further contribute to its ability to build complex PCBs with reliability and consistency.
The Benefits of TSM-DS3 are Multifold:
PCB Capability TSM-DS3
| PCB Material: | Ceramic-filled Woven Fiberglass PTFE Laminates |
| Designation: | TSM-DS3 |
| Dielectric constant: | 3 +/-0.05 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Q: What are some typical applications of TSM-DS3 PCBs?
A: TSM-DS3 PCBs find applications in couplers, phased array antennas, radar manifolds, mmWave antenna/automotive systems, oil drilling equipment, and semiconductor/ATE testing environments.
In conclusion, TSM-DS3 PCBs represent a groundbreaking advancement in circuit board technology, offering unmatched performance and reliability for a wide range of high-power applications. With its exceptional characteristics and versatile applications, TSM-DS3 is poised to revolutionize the electronics industry worldwide.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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